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LM556CM/NOPB

Texas Instruments

LM556CM/NOPB by Texas Instruments

LM556CM/NOPB by Texas Instruments is a dual-function analog waveform generator with a supply voltage range of 4.5V to 16V. It comes in a small outline package with 14 terminals and operates b/w 0°C to 70°C. Ideal for applications requiring pulse generation or rectangular waveforms in commercial-grade environments.

Median Price

$0.590

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 296 parts In-Stock

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$0.590

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$0.580

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$0.570

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296

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Adafruit Industries

USA . 870 parts In-Stock

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Vyrian

USA . 3,234 parts In-Stock

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Digiode

USA . 1,729 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Anansix

USA . 413 parts In-Stock

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First Choice Components Inc.

USA . 31 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

USA . 25 parts In-Stock

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Connector Distribution Corp

USA . 12 parts In-Stock

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Right Parts Inc.

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Semicontronic

India . 864 parts In-Stock

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$6.500

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$6.338

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$6.305

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864

$6.500

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$6.305

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Ampacity Inc.

Singapore . 566 parts In-Stock

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$6.500

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566

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Parana Technologies

USA . 1,379 parts In-Stock

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$14.892

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$15.321

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1,379

$14.892

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$15.321

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DigiPath Technology Company

USA . 159 parts In-Stock

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$16.398

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$15.086

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159

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$15.086

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IDEA Electronic Components Group

UK . 2,168 parts In-Stock

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$16.733

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$15.896

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$15.060

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$15.060

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ChromeModa Solutions

Germany . 457 parts In-Stock

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$16.733

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$13.721

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457

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$13.721

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AZTECH Wire

Italy . 679 parts In-Stock

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$18.880

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Corohmni

South Africa . 280 parts In-Stock

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$21.137

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Component Stockers USA

USA . 793 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 22,528 parts In-Stock

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Perfect Parts

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Corphita

USA . 1,337 parts In-Stock

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Argo Parts USA

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Assy Fe

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Advanced Electronics

New Zealand . 870 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Microchip USA

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the LM556CM/NOPB analog waveform generation IC. This versatile component offers dual functions in a compact rectangular package, making it ideal for a wide range of applications. From pulse generation to rectangular waveform shaping, this IC delivers precise performance and consistent results. Trust Texas Instruments for cutting-edge technology that empowers your designs and enhances your projects. Elevate your work with the LM556CM/NOPB and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material is durable and cost-effective, making the product a good choice for various applications.

Surface Mount:

YES - Being surface mountable allows for easier and more efficient assembly, making this product a convenient choice for manufacturers.

No. of Functions:

2 - With dual functions, this product offers versatility and flexibility in waveform generation, making it a versatile choice for different uses.

Package Shape:

RECTANGULAR - The rectangular shape of the package allows for efficient use of space on a circuit board, making this product a compact and space-saving choice.

Nominal Supply Voltage (Vsup):

5 V - The 5 V supply voltage is a standard and widely available power source, making this product compatible with many systems.

Power Supplies (V):

5/15 - The range of power supply options allows for customization and optimization of performance, making this product a versatile choice for different requirements.

No. of Terminals:

14 - With 14 terminals, this product offers ample connectivity options, making it suitable for complex circuit designs.

Package Style (Meter):

SMALL OUTLINE - The small outline package style saves space and allows for high-density mounting, making this product suitable for compact designs.

Maximum Operating Temperature:

70 °C - The high maximum operating temperature ensures reliability and performance in various environments, making this product a robust choice for different applications.

Minimum Operating Temperature:

0 °C - The low minimum operating temperature allows for use in a wide range of conditions, making this product versatile and adaptable.

Terminal Finish:

MATTE TIN - The matte tin finish provides corrosion resistance and solderability, making this product reliable and long-lasting.

Terminal Position:

DUAL - Dual terminal positions offer flexibility in board layout and assembly, making this product user-friendly and easy to integrate.

Maximum Seated Height:

1.75 mm - The low seated height allows for compact designs and efficient use of space, making this product suitable for applications with size constraints.

Width (mm):

3.9 mm - The small width of 3.9 mm allows for high-density designs and space-saving layouts, making this product ideal for compact systems.

Other IC type:

PULSE; RECTANGULAR - Offering pulse and rectangular waveform generation, this product provides diverse functionalities, making it a versatile choice for signal processing applications.

Minimum Supply Voltage (Vsup):

4.5 V - The low minimum supply voltage ensures compatibility with a wide range of power sources, making this product versatile and adaptable.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum time at peak reflow temperature allows for reliable soldering processes, making this product easy to install and maintain.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature ensures quality soldering joints and reliability, making this product a durable and long-lasting choice.

Length:

8.65 mm - The length of 8.65 mm allows for compact designs and efficient use of space, making this product suitable for applications with size constraints.

Temperature Grade:

COMMERCIAL - The commercial temperature grade ensures compatibility with standard operating conditions, making this product a widely applicable choice.

Technology:

BIPOLAR - Using bipolar technology provides high speed and precision in waveform generation, making this product suitable for signal processing applications.

Terminal Form:

GULL WING - The gull-wing terminal form offers easy soldering and reliable connections, making this product user-friendly and durable.

Terminal Pitch:

1.27 mm - The small terminal pitch of 1.27 mm allows for high-density mounting and space-saving layouts, making this product suitable for compact designs.

Maximum Supply Voltage (Vsup):

16 V - The high maximum supply voltage provides flexibility and compatibility with a wide range of power sources, making this product versatile and reliable.

Technical Specifications

Analog Waveform Generation LM556CM/NOPB attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

LM556CM/NOPB Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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