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TLC555TDF1

Texas Instruments

TLC555TDF1 by Texas Instruments

TLC555TDF1 by Texas Instruments is an 8-terminal CMOS IC for analog waveform generation. It operates b/w 2-15V, suitable for pulse applications. With a compact rectangular package, it's ideal for surface mount designs in various electronic devices.

Median Price

$0.299

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.299

10k+ parts

$0.281

2,520

-

-

$0.299

$0.281

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,593 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,593

-

-

-

-

Digiode

USA . 927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

927

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,769 parts In-Stock

1+ parts

$0.333

100+ parts

-

1k+ parts

-

10k+ parts

-

2,769

$0.333

-

-

-

Semicontronic

India . 2,699 parts In-Stock

1+ parts

$0.333

100+ parts

$0.325

1k+ parts

$0.323

10k+ parts

-

2,699

$0.333

$0.325

$0.323

-

Corohmni

South Africa . 207 parts In-Stock

1+ parts

$0.392

100+ parts

-

1k+ parts

-

10k+ parts

-

207

$0.392

-

-

-

Parana Technologies

USA . 282 parts In-Stock

1+ parts

$4.926

100+ parts

-

1k+ parts

$5.460

10k+ parts

-

282

$4.926

-

$5.460

-

DigiPath Technology Company

USA . 2,058 parts In-Stock

1+ parts

$5.424

100+ parts

$4.990

1k+ parts

-

10k+ parts

-

2,058

$5.424

$4.990

-

-

IDEA Electronic Components Group

UK . 1,445 parts In-Stock

1+ parts

$5.535

100+ parts

-

1k+ parts

$4.982

10k+ parts

-

1,445

$5.535

-

$4.982

-

ChromeModa Solutions

Germany . 946 parts In-Stock

1+ parts

$5.535

100+ parts

$4.539

1k+ parts

-

10k+ parts

-

946

$5.535

$4.539

-

-

Microchip USA

USA . 1,512 parts In-Stock

1+ parts

$28.490

100+ parts

$28.080

1k+ parts

$27.880

10k+ parts

$27.680

1,512

$28.490

$28.080

$27.880

$27.680

QUARKTWIN TECHNOLOGY LTD

USA . 4,366 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,366

-

-

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Corphita

USA . 1,384 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,384

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Overview

Unlock endless possibilities with the TLC555TDF1 by Texas Instruments, a top-quality analog waveform generation chip that delivers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this surface-mount chip is perfect for a wide range of applications in areas such as pulse generation and signal processing. With its compact design and advanced CMOS technology, the TLC555TDF1 offers customers unbeatable value, efficiency, and versatility. Experience the difference with Texas Instruments - get your hands on the TLC555TDF1 today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and convenient integration into circuit boards, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular package shape enables efficient placement on circuit boards and enhances overall design aesthetics.

No. of Terminals: 8

Having 8 terminals provides flexibility in connectivity options and allows for a variety of circuit configurations.

Package Style: UNCASED CHIP

Uncased chip package style is compact and lightweight, ideal for applications where size and weight are critical factors.

Terminal Position: UPPER

Upper terminal position facilitates easy access and connection, simplifying installation and maintenance processes.

Width (mm): 1.27 mm

Narrow width of 1.27mm makes the product suitable for compact designs and applications with limited space constraints.

Other IC type: PULSE; RECTANGULAR

Support for pulse and rectangular waveforms enhances the versatility and functionality of the product for a wide range of waveform generation applications.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage of 2V allows for operation in low-power applications and extends battery life in portable devices.

Length: 1.651 mm

Compact length of 1.651mm further contributes to space-saving benefits and enables integration in tight spaces.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital circuitry, ensuring efficient and reliable performance.

Terminal Form: NO LEAD

No-lead terminal form simplifies soldering processes, enhances electrical connections, and contributes to a cleaner and more organized circuit board layout.

Maximum Supply Voltage (Vsup): 15 V

High maximum supply voltage of 15V supports robust and versatile operation, suitable for a wide range of applications requiring higher voltage levels.

Technical Specifications

Analog Waveform Generation TLC555TDF1 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-XUUC-N8

Length:

1.651 mm

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.27 mm

Trade Compliance

TLC555TDF1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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