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LM556CM

Texas Instruments

LM556CM by Texas Instruments

LM556CM by Texas Instruments is a dual-function analog waveform generator with a nominal voltage of 5V. It operates in temperatures ranging from 0 to 70°C and supports power supplies of 5/15V. Ideal for applications requiring pulse and rectangular waveforms, it comes in a small outline package with gull wing terminals.

Median Price

$0.852

Lifecycle Status

Suppliers In-Stock

45

In-Stock Inventory

1k+

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Verical

USA . 831 parts In-Stock

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$0.852

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$0.759

Rochester

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$0.681

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DigiKey

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Digiode

USA . 1,632 parts In-Stock

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Nova Conductors

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First Choice Components Inc.

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Atlantic Semiconductor

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Semtec, LLC

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Ampacity Inc.

Singapore . 1,266 parts In-Stock

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$0.570

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$0.570

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Semicontronic

India . 1,089 parts In-Stock

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$0.570

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$0.556

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$0.553

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$0.570

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Corphita

USA . 3,528 parts In-Stock

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$0.605

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Argo Parts USA

USA . 1,684 parts In-Stock

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$0.648

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$0.628

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$0.628

Continental Prestige Electronics

USA . 732 parts In-Stock

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$0.648

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$0.635

732

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Bastille Electronics

Australia . 50 parts In-Stock

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$0.648

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$0.616

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$0.585

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$0.577

50

$0.648

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$0.585

$0.577

Parana Technologies

USA . 855 parts In-Stock

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$2.884

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$267.869

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$2.596

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855

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DigiPath Technology Company

USA . 1,369 parts In-Stock

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$3.176

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$3.176

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ChromeModa Solutions

Germany . 5,059 parts In-Stock

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$3.241

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$2.658

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IDEA Electronic Components Group

UK . 362 parts In-Stock

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$3.241

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$2.917

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Corohmni

South Africa . 1,100 parts In-Stock

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$17.902

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Metaverse IC Inc.

Canada . 38,500 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,184 parts In-Stock

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Component Stockers USA

USA . 6,671 parts In-Stock

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$0.670

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Perfect Parts

USA . 6,299 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,230 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

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GreenTree Electronics

Israel . 728 parts In-Stock

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Microchip USA

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Overview

Experience the exceptional quality and reliability of the LM556CM by Texas Instruments, a leading manufacturer in the industry. This versatile analog waveform generation device offers a wide range of applications, from pulse to rectangular waveforms. With a small outline package design and dual terminal position, this product is perfect for various projects where precision and efficiency are key. Trust in Texas Instruments for superior performance and value with the LM556CM.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the product onto circuit boards, saving time and labor costs during manufacturing.

Nominal Supply Voltage (Vsup): 5 V

The 5V supply voltage ensures compatibility with commonly used power sources, making it suitable for a wide range of applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows the product to withstand harsh environments and extended use without overheating.

Technology: BIPOLAR

The bipolar technology used in the product ensures accurate and stable waveform generation, making it ideal for precision applications.

Technical Specifications

Analog Waveform Generation LM556CM attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e0

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width (mm):

3.9 mm

Trade Compliance

LM556CM Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-543-4028, 5962015434028

NIIN

015434028

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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