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TLC555MDR

Texas Instruments

TLC555MDR by Texas Instruments

TLC555MDR by Texas Instruments is an Analog Waveform Generation IC with a 1.2 GHz max output frequency and operates at -55 to 125 °C. It has 8 terminals, supports supply voltages of 2-15 V, and is ideal for military-grade applications requiring CMOS technology in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,984 parts In-Stock

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Digiode

USA . 1,852 parts In-Stock

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1,852

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 296 parts In-Stock

1+ parts

$0.500

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296

$0.500

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Ampacity Inc.

Singapore . 663 parts In-Stock

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$2.500

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663

$2.500

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AZTECH Wire

Italy . 855 parts In-Stock

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$5.959

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855

$5.959

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Semicontronic

India . 154 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

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$6.305

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154

$6.500

$6.338

$6.305

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Parana Technologies

USA . 1,671 parts In-Stock

1+ parts

$13.492

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$14.005

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1,671

$13.492

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$14.005

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DigiPath Technology Company

USA . 300 parts In-Stock

1+ parts

$14.857

100+ parts

$13.668

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300

$14.857

$13.668

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ChromeModa Solutions

Germany . 6,317 parts In-Stock

1+ parts

$15.160

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$12.431

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6,317

$15.160

$12.431

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IDEA Electronic Components Group

UK . 718 parts In-Stock

1+ parts

$15.160

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$14.402

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$13.644

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718

$15.160

$14.402

$13.644

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Corphita

USA . 2,754 parts In-Stock

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2,754

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Corohmni

South Africa . 403 parts In-Stock

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Overview

Unlock endless possibilities with the TLC555MDR by Texas Instruments, a premium analog waveform generation solution that guarantees unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this innovative product offers exceptional value and benefits to customers across various applications. Whether you're looking to enhance your audio systems or improve signal processing, the TLC555MDR delivers top-notch performance and efficiency. Trust Texas Instruments for cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is lightweight, durable, and cost-effective, making the product suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy assembly onto circuit boards, saving space and making the product ideal for compact designs.

Nominal Supply Voltage (Vsup): 5 V

Operating at a standard 5V supply voltage, this product can be easily integrated into existing systems without the need for additional power conversion.

Maximum Output Frequency: 1.2 GHz

With a high output frequency of 1.2 GHz, this product is capable of generating precise and complex waveforms for advanced applications such as telecommunications or signal processing.

Maximum Operating Temperature: 125 °C

The wide operating temperature range of up to 125°C ensures reliable performance in harsh environmental conditions.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for long-term use.

Technical Specifications

Analog Waveform Generation TLC555MDR attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE AT 15 V NOMINAL SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Frequency:

1.2 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TLC555MDR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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