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TLC556MN

Texas Instruments

TLC556MN by Texas Instruments

TLC556MN by Texas Instruments is a dual-function analog waveform generator with 1.2 GHz max output frequency, operating at -55 to 125 °C. It has 14 terminals in rectangular package style, suitable for military-grade applications requiring CMOS technology and supply voltage range of 2-15 V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,656 parts In-Stock

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Digiode

USA . 4,654 parts In-Stock

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4,654

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Distributors (Availability)

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Semicontronic

India . 616 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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616

$1.500

$1.462

$1.455

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$1.692

100+ parts

$1.540

1k+ parts

$1.387

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450

$1.692

$1.540

$1.387

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AZTECH Wire

Italy . 780 parts In-Stock

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$5.122

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780

$5.122

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Ampacity Inc.

Singapore . 771 parts In-Stock

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$5.500

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771

$5.500

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One Stop Electronics

USA . 1,349 parts In-Stock

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$7.500

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1,349

$7.500

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Parana Technologies

USA . 1,621 parts In-Stock

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$11.521

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$11.932

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1,621

$11.521

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$11.932

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DigiPath Technology Company

USA . 2,180 parts In-Stock

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$12.686

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$11.671

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2,180

$12.686

$11.671

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ChromeModa Solutions

Germany . 3,801 parts In-Stock

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$12.945

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$10.615

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3,801

$12.945

$10.615

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IDEA Electronic Components Group

UK . 1,798 parts In-Stock

1+ parts

$12.945

100+ parts

$12.298

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$11.650

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1,798

$12.945

$12.298

$11.650

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Corphita

USA . 864 parts In-Stock

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Corohmni

South Africa . 370 parts In-Stock

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Overview

Unlock the power of analog waveform generation with the Texas Instruments TLC556MN. Crafted with precision and quality by a trusted manufacturer, this versatile component offers dual functions and a wide operating temperature range. Ideal for a variety of applications, this product delivers exceptional performance with a nominal supply voltage of 5V and a maximum output frequency of 1.2 GHz. Trust in Texas Instruments to provide top-of-the-line solutions for your electronic needs. Elevate your projects with the TLC556MN today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, providing protection and ease of handling.

No. of Functions: 2

Allows for multiple functions to be performed efficiently in one device.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage requirement for compatibility with various systems.

Maximum Output Frequency: 1.2 GHz

High frequency output capability for advanced waveform generation.

Minimum Operating Temperature: -55 °C

Wide operating temperature range suitable for varying environments.

Maximum Operating Temperature: 125 °C

High temperature tolerance ensuring reliability under extreme conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Maximum Supply Voltage (Vsup): 15 V

Wide supply voltage range for flexibility in power source options.

Technical Specifications

Analog Waveform Generation TLC556MN attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Additional Features:

IT CAN ALSO OPERATE AT 15V NOMINAL

Other IC type:

JESD-30 Code:

R-PDIP-T14

Length:

19.305 mm

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Frequency:

1.2 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/18

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

TLC556MN Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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