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NE556F

NXP Semiconductors

NE556F by NXP Semiconductors

PULSE; Temperature Grade: COMMERCIAL; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;

Median Price

$6.123

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 6 parts In-Stock

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$6.123

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$7.347

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$6.062

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Digiode

USA . 8,668 parts In-Stock

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Vyrian

USA . 6,753 parts In-Stock

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Anansix

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Electronic Expediters

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Mentor Electronics Marketing, LLC

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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PAR Electronics

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Mil-Aero Solutions, Inc.

USA . 5 parts In-Stock

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Sunrise Surplus Inc.

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Distributors (Availability)

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One Stop Electronics

USA . 1,021 parts In-Stock

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$4.500

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IDEA Electronic Components Group

UK . 1,804 parts In-Stock

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MKK Technologies

India . 451 parts In-Stock

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$21.154

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DigiPath Technology Company

USA . 451 parts In-Stock

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UNI Independent Distributors

Spain . 5,884 parts In-Stock

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Corphita

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Parana Technologies

USA . 1,433 parts In-Stock

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Infinite Electronics LLP (Excess)

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Kepictronics

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Perfect Parts

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Technical Specifications

Analog Waveform Generation NE556F attributes and parameters. Explore more Analog Waveform Generation devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-GDIP-T14

Length:

19.535 mm

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Current (Isup):

30 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

NE556F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-028-9756, 5962010289756, 5962-01-312-2316, 5962013122316

NIIN

010289756, 013122316

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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