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NE556DE4

Texas Instruments

NE556DE4 by Texas Instruments

NE556DE4 by Texas Instruments is an Analog Waveform Generation IC with 14 terminals and a supply voltage range of 4.5V to 16V. It operates b/w 0°C to 70°C, making it suitable for commercial applications requiring pulse generation in a small outline package. The IC features gull wing terminals and can withstand peak reflow temperatures up to 260°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 39 parts In-Stock

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Vyrian

USA . 2,634 parts In-Stock

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2,634

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Digiode

USA . 148 parts In-Stock

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148

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Semicontronic

India . 39 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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39

$4.500

$4.388

$4.365

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Ampacity Inc.

Singapore . 39 parts In-Stock

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$6.500

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39

$6.500

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Parana Technologies

USA . 1,949 parts In-Stock

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$7.163

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$7.670

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$7.163

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$7.670

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DigiPath Technology Company

USA . 696 parts In-Stock

1+ parts

$7.887

100+ parts

$7.256

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696

$7.887

$7.256

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ChromeModa Solutions

Germany . 457 parts In-Stock

1+ parts

$8.048

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$6.599

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457

$8.048

$6.599

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IDEA Electronic Components Group

UK . 356 parts In-Stock

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$8.048

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$7.243

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356

$8.048

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$7.243

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Corohmni

South Africa . 4 parts In-Stock

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$12.752

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4

$12.752

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AZTECH Wire

Italy . 741 parts In-Stock

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$17.850

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741

$17.850

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Corphita

USA . 1,198 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Continental Prestige Electronics

USA . 600 parts In-Stock

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600

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Argo Parts USA

USA . 441 parts In-Stock

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441

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Advanced Electronics

New Zealand . 39 parts In-Stock

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39

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Overview

Elevate your analog waveform generation with the NE556DE4 by Texas Instruments, a high-quality product that offers unmatched performance and reliability. Crafted by a trusted manufacturer, this versatile component is perfect for a wide range of applications. Experience seamless integration, precise outputs, and exceptional durability with the NE556DE4. Unlock new possibilities and elevate your projects with this top-tier solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and reliability of the product.

Surface Mount: YES

The surface mount design allows for easy installation and integration into electronic circuits.

Nominal Supply Voltage (Vsup): 5 V

The 5V nominal supply voltage provides compatibility with a wide range of electronic devices.

Power Supplies (V): 4.5/16

The wide range of power supplies from 4.5V to 16V accommodates different power requirements in various applications.

No. of Terminals: 14

The 14 terminals provide ample connections for interfacing with other components in the system.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact PCB designs.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high-temperature environments.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes this product suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold terminal finish ensures reliable and long-lasting electrical connections.

Terminal Position: DUAL

The dual terminal position design provides flexibility in mounting and installation options.

Width (mm): 3.9 mm

The narrow width of 3.9mm allows for compact and space-saving designs.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V ensures compatibility with low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures secure and reliable solder joints.

Length: 8.65 mm

The length of 8.65mm provides a compact form factor for easy integration into electronic systems.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliability and performance in standard operating conditions.

Technology: BIPOLAR

The bipolar technology used in this product offers high precision and stability in waveform generation.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy soldering and secure connections.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm provides compatibility with standard PCB designs.

Maximum Supply Voltage (Vsup): 16 V

The maximum supply voltage of 16V allows for high-power applications and compatibility with a wide range of devices.

Technical Specifications

Analog Waveform Generation NE556DE4 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Additional Features:

CAN ALSO OPERATE FROM A 15V NOMINAL SUPPLY

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

4.5/16

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

NE556DE4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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