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TLC556CNP3

Texas Instruments

TLC556CNP3 by Texas Instruments

TLC556CNP3 by Texas Instruments is a CMOS analog waveform generator with 14 terminals. It operates b/w 0-70°C, powered by 5/18V supplies. The rectangular package is made of plastic/epoxy, suitable for commercial applications requiring precise waveform generation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,576 parts In-Stock

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3,576

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Digiode

USA . 2,946 parts In-Stock

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2,946

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,432 parts In-Stock

1+ parts

$2.500

100+ parts

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1,432

$2.500

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Semicontronic

India . 733 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

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733

$2.500

$2.438

$2.425

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One Stop Electronics

USA . 1,116 parts In-Stock

1+ parts

$5.500

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1,116

$5.500

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AZTECH Wire

Italy . 804 parts In-Stock

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$10.669

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804

$10.669

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Parana Technologies

USA . 1,959 parts In-Stock

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$19.352

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$19.372

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1,959

$19.352

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$19.372

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ChromeModa Solutions

Germany . 4,482 parts In-Stock

1+ parts

$21.744

100+ parts

$17.830

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4,482

$21.744

$17.830

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IDEA Electronic Components Group

UK . 988 parts In-Stock

1+ parts

$21.744

100+ parts

$20.657

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$19.570

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988

$21.744

$20.657

$19.570

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Corphita

USA . 1,169 parts In-Stock

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1,169

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DigiPath Technology Company

USA . 762 parts In-Stock

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$19.604

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762

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$19.604

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Corohmni

South Africa . 133 parts In-Stock

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Overview

Unlock endless possibilities with the TLC556CNP3 by Texas Instruments, a top-of-the-line analog waveform generation component. Crafted with precision and expertise, this product boasts unparalleled quality and reliability. From automotive to industrial applications, its versatility knows no bounds. Experience seamless performance and unmatched value with this innovative solution. Elevate your projects and take them to new heights with the TLC556CNP3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic systems and designs.

Power Supplies (V): 5/18

The dual power supply options of 5V and 18V provide flexibility in powering the device according to different requirements.

No. of Terminals: 14

With 14 terminals, this product offers a wide range of connectivity options for complex circuit configurations.

Package Style (Meter): IN-LINE

The in-line package style saves space and allows for efficient use of PCB real estate.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in demanding environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C indicates the product can operate in a wide range of temperature conditions.

Terminal Position: DUAL

The dual terminal position provides flexibility in connection options, making it easier to integrate into different systems.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures the product meets standard operating temperature requirements for most applications.

Technology: CMOS

The CMOS technology used in this product provides low power consumption and high noise immunity, making it ideal for precision waveform generation.

Terminal Form: THROUGH-HOLE

The through-hole terminal form allows for easy soldering and robust connections, ensuring long-term reliability.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54 mm enables easy connection to standard PCB layouts and components, facilitating efficient assembly.

Technical Specifications

Analog Waveform Generation TLC556CNP3 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/18

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TLC556CNP3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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