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NE556DP3

Texas Instruments

NE556DP3 by Texas Instruments

NE556DP3 by Texas Instruments is a dual terminal analog waveform generator with power supplies of 5/15V. It operates b/w 0-70°C, suitable for commercial applications. The small outline rectangular package is surface mountable and made of plastic/epoxy material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,700 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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5,700

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Digiode

USA . 2,157 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,157

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 483 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

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10k+ parts

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483

$2.500

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Semicontronic

India . 1,494 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

10k+ parts

-

1,494

$5.500

$5.362

$5.335

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One Stop Electronics

USA . 1,023 parts In-Stock

1+ parts

$6.500

100+ parts

-

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1,023

$6.500

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AZTECH Wire

Italy . 855 parts In-Stock

1+ parts

$11.601

100+ parts

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855

$11.601

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Parana Technologies

USA . 91 parts In-Stock

1+ parts

$21.269

100+ parts

-

1k+ parts

$21.575

10k+ parts

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91

$21.269

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$21.575

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DigiPath Technology Company

USA . 710 parts In-Stock

1+ parts

$23.420

100+ parts

-

1k+ parts

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710

$23.420

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ChromeModa Solutions

Germany . 3,966 parts In-Stock

1+ parts

$23.898

100+ parts

$19.596

1k+ parts

-

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3,966

$23.898

$19.596

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IDEA Electronic Components Group

UK . 505 parts In-Stock

1+ parts

$23.898

100+ parts

$22.703

1k+ parts

$21.508

10k+ parts

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505

$23.898

$22.703

$21.508

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Corphita

USA . 2,324 parts In-Stock

1+ parts

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100+ parts

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2,324

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Corohmni

South Africa . 84 parts In-Stock

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84

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Overview

Elevate your analog waveform generation with the NE556DP3 by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions for a wide range of applications. This versatile component offers customers the value of precise waveform control, seamless integration with surface mounting, and a small outline package style for space-saving benefits. Whether you're designing audio equipment, communication devices, or industrial automation systems, the NE556DP3 provides the performance and reliability you need. Experience the advantages of Texas Instruments technology with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and reliability of the product, making it suitable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact and space-saving design, making it ideal for applications where size is a constraint.

Power Supplies (V): 5/15

Support for multiple power supply voltages gives flexibility in the application, allowing compatibility with different system requirements.

No. of Terminals: 14

Having 14 terminals allows for more connections and integration options, making the product versatile and adaptable to various circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style offers space efficiency and easy integration into compact electronic devices or systems.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance ensures reliable performance even under demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Wide temperature range support enables the product to function effectively in various temperature environments, increasing its usability.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting orientations, offering flexibility in the installation and connection of the product.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating environments, making the product suitable for a wide range of industrial applications.

Technology: BIPOLAR

Bipolar technology offers stable and precise waveform generation capabilities, making the product ideal for applications requiring accurate analog signal generation.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections, preventing signal loss or interference, ensuring optimal performance of the product.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for high-density mounting and interconnection, enabling efficient use of space and enhancing the product's overall design.

Technical Specifications

Analog Waveform Generation NE556DP3 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G14

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5/15

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

NE556DP3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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