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JL555SGA

Texas Instruments

JL555SGA by Texas Instruments

JL555SGA by Texas Instruments is an Analog Waveform Generator with MIL-STD-883 screening. It operates b/w -55 to 125 °C, with Vsup ranging from 4.5V to 16.5V. Ideal for military applications requiring precise pulse and rectangular waveforms in a cylindrical package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,244 parts In-Stock

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Digiode

USA . 2,848 parts In-Stock

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Anansix

USA . 2,334 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 532 parts In-Stock

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$5.355

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532

$5.355

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One Stop Electronics

USA . 1,596 parts In-Stock

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$6.500

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Parana Technologies

USA . 389 parts In-Stock

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$12.697

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$13.161

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389

$12.697

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DigiPath Technology Company

USA . 62 parts In-Stock

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$13.981

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$12.862

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62

$13.981

$12.862

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ChromeModa Solutions

Germany . 2,278 parts In-Stock

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$14.266

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$11.698

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IDEA Electronic Components Group

UK . 836 parts In-Stock

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$14.266

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$13.553

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$12.839

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836

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Corphita

USA . 4,117 parts In-Stock

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Overview

Enhance your analog waveform generation capabilities with the JL555SGA from Texas Instruments. With a MIL-STD-883 screening level and military-grade temperature grade, this product ensures top-notch quality and reliability. Its compact cylindrical package is designed for easy integration, offering 5/15 power supplies and a wide operating temperature range. Perfect for applications requiring precise pulse and rectangular waveform generation, the JL555SGA provides unmatched value and benefits to customers looking for high-performance solutions. Elevate your projects with this innovative product from a trusted industry leader.

Feature Benefit Bullets

Package Body Material: METAL

Metal package body provides durability and efficient heat dissipation, ensuring the reliability and longevity of the product.

Screening Level: MIL-STD-883

Adhering to MIL-STD-883 screening standards ensures high quality and reliability, making this product suitable for demanding military and aerospace applications.

Nominal Supply Voltage (Vsup): 4.5 V

The low nominal supply voltage of 4.5 V makes this product energy-efficient and suitable for applications where power consumption is a concern.

No. of Terminals: 8

Having 8 terminals allows for versatile connectivity options and integration into various circuit designs for enhanced functionality.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperature environments and operate reliably under challenging conditions.

Technology: BIPOLAR

The bipolar technology used in this product ensures fast switching speeds and precise waveform generation, making it ideal for applications requiring accurate signal control.

Technical Specifications

Analog Waveform Generation JL555SGA attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

O-MBCY-W8

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

METAL

Package Equivalence Code:

CAN8,.2

Package Shape:

Package Style (Meter):

CYLINDRICAL

Power Supplies (V):

5/15

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn63Pb37)

Terminal Form:

WIRE

Terminal Position:

BOTTOM

Trade Compliance

JL555SGA Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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