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555/BPA

NXP Semiconductors

555/BPA by NXP Semiconductors

PULSE; Temperature Grade: MILITARY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;

Median Price

$13.335

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 67 parts In-Stock

1+ parts

$13.335

100+ parts

$14.002

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$13.202

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$13.335

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Digiode

USA . 3,570 parts In-Stock

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Vyrian

USA . 3,336 parts In-Stock

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Anansix

USA . 1,716 parts In-Stock

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LWI Electronics Inc

India . 34 parts In-Stock

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R&J Components

USA . 10 parts In-Stock

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Electronic Expediters

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Sunrise Surplus Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 257 parts In-Stock

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$0.500

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Corphita

USA . 4,494 parts In-Stock

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UNI Independent Distributors

Spain . 3,751 parts In-Stock

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Glotronic Ltd.

UK . 2,900 parts In-Stock

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Northwest PG Solutions

USA . 1,828 parts In-Stock

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Native Components

USA . 558 parts In-Stock

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558

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RTC Component Inc.

USA . 10 parts In-Stock

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Technical Specifications

Analog Waveform Generation 555/BPA attributes and parameters. Explore more Analog Waveform Generation devices from NXP Semiconductors

Specs

Additional Features:

IT CAN ALSO OPERATE AT 15V NOM

Other IC type:

JESD-30 Code:

R-GDIP-T8

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

555/BPA Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

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