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NE556N3

Texas Instruments

NE556N3 by Texas Instruments

NE556N3 by Texas Instruments is a 14-terminal analog waveform generator with power supplies of 5/15V. Operating b/w 0-70°C, it's ideal for commercial applications requiring bipolar technology and through-hole terminal form in a rectangular package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,994 parts In-Stock

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5,994

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Digiode

USA . 392 parts In-Stock

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392

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Distributors (Availability)

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Ampacity Inc.

Singapore . 802 parts In-Stock

1+ parts

$3.500

100+ parts

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802

$3.500

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One Stop Electronics

USA . 429 parts In-Stock

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$3.500

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429

$3.500

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Semicontronic

India . 885 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

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$7.275

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885

$7.500

$7.312

$7.275

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AZTECH Wire

Italy . 811 parts In-Stock

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$9.494

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811

$9.494

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Parana Technologies

USA . 81 parts In-Stock

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$10.176

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$10.717

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81

$10.176

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$10.717

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DigiPath Technology Company

USA . 2,001 parts In-Stock

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$11.205

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2,001

$11.205

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ChromeModa Solutions

Germany . 1,812 parts In-Stock

1+ parts

$11.434

100+ parts

$9.376

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1,812

$11.434

$9.376

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IDEA Electronic Components Group

UK . 216 parts In-Stock

1+ parts

$11.434

100+ parts

$10.862

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$10.291

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216

$11.434

$10.862

$10.291

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Corphita

USA . 4,503 parts In-Stock

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Corohmni

South Africa . 183 parts In-Stock

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Overview

Unlock endless possibilities with the NE556N3 by Texas Instruments, a premium Analog Waveform Generation component designed to meet your diverse electronic needs. Crafted with precision and excellence by Texas Instruments, this product ensures superior quality and reliability. From creating intricate waveforms to controlling timing circuits, this versatile device offers unparalleled performance and efficiency. Elevate your projects with the NE556N3 and experience seamless functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ideal for portable applications.

Package Shape: RECTANGULAR

The rectangular shape of the package provides easy mounting and integration into existing systems or circuit boards.

Power Supplies (V): 5/15

The versatile power supply options of 5V or 15V allow for flexibility in different operating environments and voltage requirements.

No. of Terminals: 14

The 14 terminals provide ample connectivity options for various input and output signals, enhancing the product's versatility.

Package Style (Meter): IN-LINE

The in-line package style allows for easy integration into measurement systems or setups, making it convenient for testing and calibration purposes.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliability and stable performance even in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures the product can operate effectively in a wide range of temperature environments.

Temperature Grade: COMMERCIAL

The commercial temperature grade makes the product suitable for standard commercial applications with consistent performance levels.

Technology: BIPOLAR

The bipolar technology used in the product allows for accurate waveform generation and control, ensuring precise output signals.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide secure and robust connections for reliability in demanding applications, reducing the risk of disconnection or signal loss.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy and standardized connections with other components or devices, simplifying the installation process.

Technical Specifications

Analog Waveform Generation NE556N3 attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T14

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Sub-Category:

Analog Waveform Generation Functions

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

NE556N3 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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