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TLC551CPWLE

Texas Instruments

TLC551CPWLE by Texas Instruments

TLC551CPWLE by Texas Instruments is an Analog Waveform Generation IC with a supply voltage range of 1-15V and max output frequency of 1.2GHz. It comes in a small outline package, suitable for applications requiring pulse generation or rectangular waveforms in commercial temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,480 parts In-Stock

1+ parts

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3,480

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Vyrian

USA . 2,473 parts In-Stock

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2,473

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Distributors (Availability)

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Semicontronic

India . 1,470 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

-

1,470

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 1,113 parts In-Stock

1+ parts

$6.500

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1,113

$6.500

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Ampacity Inc.

Singapore . 372 parts In-Stock

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$7.500

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372

$7.500

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AZTECH Wire

Italy . 673 parts In-Stock

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$15.667

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673

$15.667

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Parana Technologies

USA . 2,237 parts In-Stock

1+ parts

$20.749

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$20.891

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2,237

$20.749

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$20.891

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ChromeModa Solutions

Germany . 1,164 parts In-Stock

1+ parts

$23.313

100+ parts

$19.117

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1,164

$23.313

$19.117

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IDEA Electronic Components Group

UK . 1,122 parts In-Stock

1+ parts

$23.313

100+ parts

$22.147

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$20.982

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1,122

$23.313

$22.147

$20.982

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Corphita

USA . 545 parts In-Stock

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545

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DigiPath Technology Company

USA . 170 parts In-Stock

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$21.019

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170

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$21.019

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Corohmni

South Africa . 58 parts In-Stock

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the TLC551CPWLE Analog Waveform Generation IC. This versatile component boasts a wide range of applications, from pulse generation to signal conditioning. With a nominal supply voltage of 5V and a maximum output frequency of 1.2 GHz, this IC delivers exceptional performance with precision. Trust in Texas Instruments for cutting-edge technology and innovative solutions that will elevate your projects to new heights. Choose the TLC551CPWLE for superior results and unmatched value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components and ensures durability for long-term use.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

Compatible with standard voltage levels, making it versatile for a variety of applications.

Maximum Output Frequency: 1.2 GHz

Provides high-frequency output signals suitable for advanced waveform generation requirements.

Temperature Grade: COMMERCIAL

Designed for use in commercial applications where performance and reliability are essential.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high levels of integration, enhancing overall efficiency.

Technical Specifications

Analog Waveform Generation TLC551CPWLE attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Frequency:

1.2 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1/15

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

TLC551CPWLE Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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