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LMC555MWA

Texas Instruments

LMC555MWA by Texas Instruments

Texas Instruments LMC555MWA is a CMOS IC for Analog Waveform Generation. It operates b/w -40°C to 85°C with supply voltage range of 1.5V to 12V. With a max output frequency of 3 GHz, it's ideal for industrial applications requiring pulse and rectangular waveforms.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,063 parts In-Stock

1+ parts

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8,063

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Digiode

USA . 3,739 parts In-Stock

1+ parts

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3,739

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Anansix

USA . 2,826 parts In-Stock

1+ parts

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2,826

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,078 parts In-Stock

1+ parts

$7.500

100+ parts

-

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1,078

$7.500

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AZTECH Wire

Italy . 426 parts In-Stock

1+ parts

$7.603

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426

$7.603

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Parana Technologies

USA . 2,029 parts In-Stock

1+ parts

$20.062

100+ parts

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$19.993

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2,029

$20.062

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$19.993

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IDEA Electronic Components Group

UK . 1,098 parts In-Stock

1+ parts

$22.542

100+ parts

$21.415

1k+ parts

$20.288

10k+ parts

-

1,098

$22.542

$21.415

$20.288

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ChromeModa Solutions

Germany . 854 parts In-Stock

1+ parts

$22.542

100+ parts

$18.484

1k+ parts

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854

$22.542

$18.484

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Corphita

USA . 3,985 parts In-Stock

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3,985

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DigiPath Technology Company

USA . 1,089 parts In-Stock

1+ parts

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100+ parts

$20.324

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1,089

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$20.324

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Overview

Unleash the power of precision with the Texas Instruments LMC555MWA analog waveform generator. Designed for industrial-grade applications, this innovative chip offers a maximum output frequency of 3 GHz, making it ideal for a wide range of industries. From pulse to rectangular waveforms, this versatile product provides unmatched quality and reliability. Elevate your projects with the cutting-edge technology and superior performance that only Texas Instruments can deliver. Experience the difference with the LMC555MWA and unlock a world of possibilities in waveform generation.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on a circuit board, making this product convenient for compact designs.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V is commonly used in electronic devices, ensuring compatibility with a wide range of systems.

Maximum Output Frequency: 3 GHz

The high maximum output frequency of 3 GHz allows for the generation of complex waveforms and signals, making this product suitable for advanced applications.

Package Style (Meter): UNCASED CHIP

The uncased chip package style enables easy integration into custom designs and provides flexibility in mounting options.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high heat environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in cold conditions, making this product versatile in various environments.

Terminal Position: UPPER

The terminal position being upper simplifies the installation process and allows for easy connectivity with other components on the circuit board.

Other IC type: PULSE; RECTANGULAR

In addition to waveform generation, this product also supports pulse and rectangular signals, enhancing its versatility for a wide range of applications.

Minimum Supply Voltage (Vsup): 1.5 V

The low minimum supply voltage of 1.5V allows for efficient power consumption and compatibility with low-power systems, making this product energy-efficient.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets the necessary quality and reliability standards to operate in demanding environments with consistent performance.

Technology: CMOS

Built using CMOS technology, this product offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems, making it a reliable choice for various applications.

Terminal Form: NO LEAD

The no lead terminal form simplifies the manufacturing process and reduces the risk of solder joint failure, ensuring a reliable connection for long-term usage.

Maximum Supply Voltage (Vsup): 12 V

With a maximum supply voltage of 12V, this product can handle higher voltage inputs, providing versatility in different power supply scenarios.

Technical Specifications

Analog Waveform Generation LMC555MWA attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Frequency:

3 GHz

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Position:

UPPER

Trade Compliance

LMC555MWA Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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