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LMC555M

Texas Instruments

LMC555M by Texas Instruments

LMC555M by Texas Instruments is an 8-terminal CMOS analog waveform generator with a supply voltage range of 1.5V to 12V. It operates b/w -40°C to 85°C, offering a max output frequency of 3GHz. Ideal for industrial applications requiring pulse generation in compact spaces due to its small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,846 parts In-Stock

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8,846

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Digiode

USA . 2,846 parts In-Stock

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2,846

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Anansix

USA . 1,698 parts In-Stock

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1,698

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 443 parts In-Stock

1+ parts

$3.500

100+ parts

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443

$3.500

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AZTECH Wire

Italy . 248 parts In-Stock

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$10.866

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248

$10.866

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Parana Technologies

USA . 1,303 parts In-Stock

1+ parts

$16.980

100+ parts

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$17.205

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1,303

$16.980

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$17.205

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DigiPath Technology Company

USA . 1,006 parts In-Stock

1+ parts

$18.697

100+ parts

$17.202

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1,006

$18.697

$17.202

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ChromeModa Solutions

Germany . 3,037 parts In-Stock

1+ parts

$19.079

100+ parts

$15.645

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3,037

$19.079

$15.645

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IDEA Electronic Components Group

UK . 1,489 parts In-Stock

1+ parts

$19.079

100+ parts

$18.125

1k+ parts

$17.171

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1,489

$19.079

$18.125

$17.171

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Corphita

USA . 3,331 parts In-Stock

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3,331

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Overview

Unlock endless possibilities with the Texas Instruments LMC555M, a high-quality analog waveform generation component that promises reliability and superior performance. Manufactured by industry-leader Texas Instruments, this versatile product is perfect for a wide range of applications. Whether you're designing consumer electronics, automotive systems, or industrial equipment, the LMC555M offers unmatched value and benefits. Experience the advantages of cutting-edge technology and innovation with the LMC555M from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and resistance to environmental factors, making the product suitable for various industrial applications.

Surface Mount: YES

Easily mounting the product onto a PCB saves assembly time and space, making it ideal for compact designs.

Nominal Supply Voltage (Vsup): 5 V

Operating at a commonly used voltage level simplifies integration into existing systems and power supplies.

Maximum Output Frequency: 3 GHz

The high output frequency capability allows for generating waveforms at high speeds, catering to demanding applications.

No. of Terminals: 8

Having multiple terminals provides flexibility in connectivity options and allows for versatile circuit configurations.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing the product's overall efficiency and reliability.

Maximum Supply Voltage (Vsup): 12 V

The wide supply voltage range allows for compatibility with various power sources and operational flexibility.

Technical Specifications

Analog Waveform Generation LMC555M attributes and parameters. Explore more Analog Waveform Generation devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Frequency:

3 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

12 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

LMC555M Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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