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NE556D-T

NXP Semiconductors

NE556D-T by NXP Semiconductors

NE556D-T by NXP Semiconductors is a dual-function analog waveform generator with 14 terminals. It operates b/w 4.5V to 16V, suitable for commercial applications. With a small outline package style and bipolar technology, it is ideal for pulse generation in various electronic circuits.

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13

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1k+

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Adafruit Industries

USA . 200 parts In-Stock

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Semtec, LLC

USA . 17,500 parts In-Stock

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Chip Stock

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Vyrian

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Digiode

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Lantek

USA . 2,206 parts In-Stock

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Anansix

USA . 1,641 parts In-Stock

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Nova Conductors

Japan . 1,000 parts In-Stock

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Bristol Electronics

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Inventory MP

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ACDS - Activité Composants Distribution Service

France . 370 parts In-Stock

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Elcom Components

USA . 41 parts In-Stock

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Atlantic Semiconductor

USA . 6 parts In-Stock

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Ampacity Inc.

Singapore . 231 parts In-Stock

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$2.500

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Semicontronic

India . 200 parts In-Stock

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$4.500

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$4.388

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$4.365

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AZTECH Wire

Italy . 1,452 parts In-Stock

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$5.336

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Corohmni

South Africa . 107 parts In-Stock

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IDEA Electronic Components Group

UK . 46 parts In-Stock

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$21.195

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$19.075

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Microchip USA

USA . 636 parts In-Stock

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$24.310

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MKK Technologies

India . 784 parts In-Stock

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DigiPath Technology Company

USA . 784 parts In-Stock

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RC Electronics

USA . 83,231 parts In-Stock

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Kepictronics

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Perfect Parts

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Lixinc

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A-Z Elektronik GmbH

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UNI Independent Distributors

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Argo Parts USA

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GreenTree Electronics

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Continental Prestige Electronics

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Futuretech Components

Singapore . 667 parts In-Stock

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Bastille Electronics

Australia . 550 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 402 parts In-Stock

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Parana Technologies

USA . 55 parts In-Stock

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$25.342

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Overview

Discover the NE556D-T by NXP Semiconductors, a high-quality Analog Waveform Generation component that opens up endless possibilities for your projects. With its durable PLASTIC/EPOXY package and small outline design, this dual-function device is perfect for applications requiring precise waveform generation. NXP Semiconductors' commitment to excellence ensures reliable performance in temperatures ranging from 0°C to 70°C. Trust the NE556D-T to deliver unparalleled value and efficiency, making it the perfect choice for all your analog waveform needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components within the package, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 5 V

Compatible with common power sources, making it convenient for use in various applications.

Technology: BIPOLAR

Provides stable and reliable performance, suitable for generating accurate and precise analog waveforms.

Temperature Grade: COMMERCIAL

Designed to operate within standard commercial temperature ranges, ensuring consistent performance in typical environments.

Technical Specifications

Analog Waveform Generation NE556D-T attributes and parameters. Explore more Analog Waveform Generation devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

NE556D-T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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