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MC14175BFELG

Onsemi

MC14175BFELG by Onsemi

MC14175BFELG by Onsemi is a 4-bit latch with 400 ns propagation delay, operating at -55 to 125 °C. It has a supply voltage of 5V, load capacitance of 50 pF, and can handle frequencies up to 2MHz. Ideal for military-grade applications requiring fast data storage and retrieval in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,774 parts In-Stock

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Digiode

USA . 1,758 parts In-Stock

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AZTECH Wire

Italy . 434 parts In-Stock

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$16.880

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Component Stockers USA

USA . 589 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 6,771 parts In-Stock

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TANS Electronics

Latvia . 6,239 parts In-Stock

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Microchip USA

USA . 5,429 parts In-Stock

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SupplyDigital Components

Austria . 3,035 parts In-Stock

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Problanco Electronics

Mexico . 1,087 parts In-Stock

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Corphita

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Corohmni

South Africa . 195 parts In-Stock

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UHIMA Technologies

Türkiye . 144 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the MC14175BFELG by Onsemi. Crafted with precision and expertise, this latches & flip-flops component offers seamless integration and exceptional functionality in a variety of applications. With a focus on quality and innovation, Onsemi ensures that every product delivers superior value, benefits, and advantages to customers. Experience the difference with the MC14175BFELG and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection to the internal components, ensuring a long-lasting performance.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into electronic circuit boards, making it convenient for manufacturing processes.

No. of Bits: 4

With 4 bits, this latch or flip-flop can store and process a larger amount of data, making it suitable for applications that require higher computational capability.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this latch or flip-flop compatible with standard electronic systems and reduces the need for additional voltage regulation.

Propagation Delay (tpd): 400 ns

The low propagation delay of 400 ns ensures swift signal processing and minimizes latency in data transmission, improving overall system performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C allows for reliable operation in various environmental conditions, making it suitable for industrial and military applications.

Technology: CMOS

Utilizing CMOS technology in this latch or flip-flop ensures low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Maximum Frequency At Nominal Supply: 2000000 Hz

Operating at a high frequency of 2 MHz allows for fast data processing and high-speed operation, making it ideal for applications that require rapid response times.

Technical Specifications

Latches & Flip-Flops MC14175BFELG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

2000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

400 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.275 mm

Minimum fmax:

6.5 MHz

Trade Compliance

MC14175BFELG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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