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MC14050BCPG

Onsemi

MC14050BCPG by Onsemi

MC14050BCPG by Onsemi is a CMOS Logic Gates IC with 6 functions, 140 ns propagation delay at 5V. It operates in a temperature range of -55 to 125 °C and supports supply voltages from 3V to 18V. Ideal for military-grade applications requiring high-speed signal processing.

Median Price

$0.250

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$0.250

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Vyrian

USA . 6,730 parts In-Stock

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Infinite Electronics LLP

India . 1,500 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,290 parts In-Stock

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Holdelec - ElecDif-Pro

France . 1,290 parts In-Stock

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Component Sense

UK . 670 parts In-Stock

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Digiode

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Euro-Tech

UK . 154 parts In-Stock

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Bristol Electronics

USA . 110 parts In-Stock

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Electronics Depot

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Distributors (Availability)

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AZTECH Wire

Italy . 687 parts In-Stock

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$16.153

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$22.230

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$20.229

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$18.229

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Ampacity Inc.

Singapore . 422 parts In-Stock

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$31.000

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Lixinc

USA . 9,173 parts In-Stock

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SupplyDigital Components

Austria . 7,084 parts In-Stock

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TANS Electronics

Latvia . 6,715 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,375 parts In-Stock

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Problanco Electronics

Mexico . 4,744 parts In-Stock

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Kulean Microsystems

USA . 2,830 parts In-Stock

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UHIMA Technologies

Türkiye . 596 parts In-Stock

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Microchip USA

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Corphita

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Corohmni

South Africa . 184 parts In-Stock

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Unleash the power of innovation with the MC14050BCPG by Onsemi, a high-quality logic gate that offers unmatched performance and reliability. Manufactured by industry leader Onsemi, this product is designed to meet the demands of various applications with its advanced technology and precision engineering. Ideal for military-grade projects, this logic gate ensures seamless operation even in extreme temperatures. Experience the value and benefits of this top-of-the-line component, providing customers with a competitive edge in their projects. Elevate your designs with the MC14050BCPG and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 140 ns

Fast processing speed ensures efficient operation of the logic gates.

Nominal Supply Voltage / Vsup (V): 5

Compatible with common power supplies, making it easy to integrate into existing systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates energy-efficient and reliable.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, ensuring reliable performance in various operating environments.

Minimum Operating Temperature: -55 °C

Capable of operating in cold conditions without compromising functionality.

Technical Specifications

Logic Gates MC14050BCPG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e3

Length:

19.175 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

RAIL

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

140 ns

Propagation Delay (tpd):

140 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.44 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC14050BCPG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-633-2072, 5962016332072

NIIN

016332072

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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