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MC10H131M

Onsemi

MC10H131M by Onsemi

MC10H131M by Onsemi is a 2-bit latch with 1.7 ns propagation delay and max frequency of 250 MHz. It operates b/w 0-75 °C, ideal for high-speed applications in commercial settings. The ECL technology, small outline package, and surface mount capability make it versatile for various electronic designs.

Median Price

$2.030

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$2.030

1k+ parts

$1.820

10k+ parts

$1.710

4

-

$2.030

$1.820

$1.710

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 130 parts In-Stock

1+ parts

$2.147

100+ parts

-

1k+ parts

-

10k+ parts

-

130

$2.147

-

-

-

TEDSS.com

USA . 650 parts In-Stock

1+ parts

$7.500

100+ parts

$5.000

1k+ parts

-

10k+ parts

-

650

$7.500

$5.000

-

-

Vyrian

USA . 8,403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,403

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 118 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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118

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 4 parts In-Stock

1+ parts

$1.920

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$1.920

-

-

-

Corphita

USA . 772 parts In-Stock

1+ parts

$2.034

100+ parts

-

1k+ parts

-

10k+ parts

-

772

$2.034

-

-

-

Corohmni

South Africa . 327 parts In-Stock

1+ parts

$2.260

100+ parts

-

1k+ parts

-

10k+ parts

-

327

$2.260

-

-

-

AZTECH Wire

Italy . 557 parts In-Stock

1+ parts

$12.710

100+ parts

-

1k+ parts

-

10k+ parts

-

557

$12.710

-

-

-

SupplyDigital Components

Austria . 5,606 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,606

-

-

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Microchip USA

USA . 4,868 parts In-Stock

1+ parts

-

100+ parts

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4,868

-

-

-

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Kulean Microsystems

USA . 3,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,680

-

-

-

-

Problanco Electronics

Mexico . 2,029 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,029

-

-

-

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TANS Electronics

Latvia . 1,963 parts In-Stock

1+ parts

-

100+ parts

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1,963

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-

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Kepictronics

USA . 751 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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751

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-

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UHIMA Technologies

Türkiye . 385 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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385

-

-

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Overview

Enhance your electronic projects with the MC10H131M by Onsemi, a high-quality latch and flip-flop that guarantees reliability and performance. Onsemi's reputation for excellence ensures that this product meets the highest standards in the industry. Ideal for a wide range of applications, this versatile component offers customers unmatched value and benefits. Upgrade your designs with the MC10H131M and experience the advantages of seamless operation and efficient functionality. Trust Onsemi to deliver top-notch solutions for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components, making the product long-lasting and resistant to damage.

Surface Mount: YES

The surface mount capability of the product allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

No. of Bits: 2

Having 2 bits allows for more data storage and processing capabilities, making the product suitable for applications where multiple inputs are required.

Propagation Delay (tpd): 1.7 ns

The low propagation delay of 1.7 ns ensures fast and efficient operation, making the product ideal for high-speed applications that require quick response times.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75 °C, the product can withstand high temperatures without any performance issues, making it suitable for a wide range of environments.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures that the product responds accurately to input signals at the rising edge, enhancing precision and reliability in operation.

Technology: ECL

The ECL technology used in the product provides high-speed performance and low power consumption, making it an efficient choice for applications requiring fast data processing.

Technical Specifications

Latches & Flip-Flops MC10H131M attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

250000000 Hz

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

RAIL

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

62 mA

Propagation Delay (tpd):

1.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

FF/Latches

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

5.275 mm

Minimum fmax:

250 MHz

Trade Compliance

MC10H131M Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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