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MC10H131FNR2G

Onsemi

MC10H131FNR2G by Onsemi

MC10H131FNR2G by Onsemi is a 20-terminal ECL chip carrier flip-flop with 1.7ns propagation delay and 250MHz fmax. It operates b/w 0-75 °C, suitable for high-speed applications requiring positive edge triggering and complementary output polarity.

Median Price

$7.750

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 12,497 parts In-Stock

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Flip Electronics

USA . 13,000 parts In-Stock

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$7.750

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$7.750

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Vyrian

USA . 4,753 parts In-Stock

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Digiode

USA . 1,820 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,500 parts In-Stock

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1,500

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Chip Stock

USA . 512 parts In-Stock

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512

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Distributors (Availability)

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Corohmni

South Africa . 375 parts In-Stock

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$10.330

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375

$10.330

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Component Stockers USA

USA . 14,822 parts In-Stock

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$9.970

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$9.970

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$9.970

14,822

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$9.970

$9.970

$9.970

QUARKTWIN TECHNOLOGY LTD

USA . 14,249 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 4,588 parts In-Stock

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Problanco Electronics

Mexico . 4,464 parts In-Stock

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Microchip USA

USA . 4,194 parts In-Stock

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TANS Electronics

Latvia . 3,626 parts In-Stock

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Corphita

USA . 2,328 parts In-Stock

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Kulean Microsystems

USA . 820 parts In-Stock

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820

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UHIMA Technologies

Türkiye . 353 parts In-Stock

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Legend Electronics Inc. (Excess)

USA . 225 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 225 parts In-Stock

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Metaverse IC Inc.

Canada . 210 parts In-Stock

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Kepictronics

USA . 175 parts In-Stock

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Overview

Discover the MC10H131FNR2G by Onsemi, a top-of-the-line latches & flip-flops product that offers unparalleled quality and reliability. Manufactured by Onsemi, a trusted industry leader, this chip carrier package delivers superior performance and precision. Perfect for a wide range of applications, this innovative technology provides customers with fast propagation delay, high frequency capabilities, and complementary output polarity. Invest in the MC10H131FNR2G for seamless operation and optimal results in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the latch, ensuring a longer lifespan.

Surface Mount: YES

The surface mount capability makes it easy to install and allows for efficient use of space on a circuit board.

Propagation Delay (tpd): 1.7 ns

With a low propagation delay, this latch can quickly respond to input changes, making it suitable for high-speed applications.

Maximum Operating Temperature: 75 °C

The high operating temperature range allows the latch to function reliably in various environmental conditions.

Output Characteristics: OPEN-EMITTER

The open-emitter output allows for flexibility in connecting to other components, enhancing compatibility and integration in a circuit.

Temperature Grade: COMMERCIAL EXTENDED

This temperature grade indicates that the latch is suitable for commercial applications and can operate reliably over an extended temperature range.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making it ideal for applications that require fast and efficient data processing.

Technical Specifications

Latches & Flip-Flops MC10H131FNR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

250000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

62 mA

Propagation Delay (tpd):

1.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FF/Latches

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

8.965 mm

Minimum fmax:

250 MHz

Trade Compliance

MC10H131FNR2G Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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