Loading...

MC10H130FNR2G

Onsemi

MC10H130FNR2G by Onsemi

MC10H130FNR2G by Onsemi is a 20-terminal ECL chip carrier with 1.7ns propagation delay, suitable for latches & flip-flops. It operates b/w 0-75 °C, has low-level trigger type, and offers complementary output polarity. Ideal for applications requiring fast signal processing in commercial extended temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,399

-

-

-

-

Digiode

USA . 172 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

172

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 257 parts In-Stock

1+ parts

$15.040

100+ parts

-

1k+ parts

-

10k+ parts

-

257

$15.040

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,754 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,754

-

-

-

-

SupplyDigital Components

Austria . 8,204 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,204

-

-

-

-

Kulean Microsystems

USA . 7,903 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,903

-

-

-

-

Problanco Electronics

Mexico . 1,808 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,808

-

-

-

-

Corphita

USA . 488 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

488

-

-

-

-

Microchip USA

USA . 410 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

410

-

-

-

-

TANS Electronics

Latvia . 263 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

263

-

-

-

-

Corohmni

South Africa . 226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

226

-

-

-

-

UHIMA Technologies

Türkiye . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8

-

-

-

-

Overview

Unlock the power of high-quality, reliable technology with the MC10H130FNR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch latches & flip-flops that guarantee superior performance and durability. Ideal for a wide range of applications, this product offers lightning-fast propagation delay, surface mount capability, and a compact chip carrier package style. Experience the value of efficiency and precision with the MC10H130FNR2G, providing customers with unmatched benefits and advantages in their projects. Elevate your designs with Onsemi's innovative technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the latch or flip-flop easy to handle and install.

Propagation Delay At Nominal Supply: 1.9 ns

With a low propagation delay, this latch or flip-flop ensures quick response times and efficient data processing.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and simplifying assembly.

No. of Bits: 2

Having 2 bits allows for a wider range of data processing capabilities in the latch or flip-flop.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, this product is suitable for a variety of environments and applications.

Output Characteristics: OPEN-EMITTER

The open-emitter output allows for flexibility in connecting to other components or devices, enhancing compatibility and versatility.

Trigger Type: LOW LEVEL

The low-level trigger type ensures reliable and consistent performance in triggering the latch or flip-flop.

Technology: ECL

Using ECL technology provides high-speed operation and low power consumption, making this product efficient and reliable.

Packing Method: TR

The TR packing method ensures safe and secure transportation of the latch or flip-flop, reducing the risk of damage during shipping.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for fine spacing between terminals, enabling compact design and integration in tight spaces.

Technical Specifications

Latches & Flip-Flops MC10H130FNR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Family:

10H

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Logic IC Type:

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Propagation Delay At Nominal Supply:

1.9 ns

Propagation Delay (tpd):

1.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FF/Latches

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trigger Type:

LOW LEVEL

Width:

8.965 mm

Trade Compliance

MC10H130FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20