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MC10H116DR2G

Onsemi

MC10H116DR2G by Onsemi

MC10H116DR2G by Onsemi is a 3-function line driver with -5.2V power supply, ECL technology, and 1.3ns max receive delay. Ideal for commercial extended temperature grade applications requiring differential input characteristics and gull wing terminal form.

Median Price

$3.408

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$2.747

100+ parts

$2.747

1k+ parts

$2.747

10k+ parts

$2.747

1

$2.747

$2.747

$2.747

$2.747

Rochester

USA . 4,935 parts In-Stock

1+ parts

$4.070

100+ parts

$3.990

1k+ parts

$3.910

10k+ parts

-

4,935

$4.070

$3.990

$3.910

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 246 parts In-Stock

1+ parts

$2.610

100+ parts

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246

$2.610

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Vyrian

USA . 8,472 parts In-Stock

1+ parts

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8,472

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Flip Electronics

USA . 7,500 parts In-Stock

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7,500

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Bristol Electronics

USA . 2,316 parts In-Stock

1+ parts

-

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2,316

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Atlantic Semiconductor

USA . 2,316 parts In-Stock

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2,316

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1 parts In-Stock

1+ parts

$2.330

100+ parts

-

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10k+ parts

-

1

$2.330

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-

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Corphita

USA . 1,571 parts In-Stock

1+ parts

$2.472

100+ parts

-

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1,571

$2.472

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Corohmni

South Africa . 118 parts In-Stock

1+ parts

$2.747

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118

$2.747

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AZTECH Wire

Italy . 630 parts In-Stock

1+ parts

$10.210

100+ parts

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630

$10.210

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Problanco Electronics

Mexico . 8,399 parts In-Stock

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8,399

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Microchip USA

USA . 4,427 parts In-Stock

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4,427

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SupplyDigital Components

Austria . 4,032 parts In-Stock

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4,032

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Kulean Microsystems

USA . 2,239 parts In-Stock

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2,239

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Kepictronics

USA . 2,122 parts In-Stock

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2,122

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TANS Electronics

Latvia . 1,299 parts In-Stock

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1,299

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UHIMA Technologies

Türkiye . 792 parts In-Stock

1+ parts

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792

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Speed Components Ltd (Excess)

Israel . 85 parts In-Stock

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85

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Netroflash

USA . 50 parts In-Stock

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50

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Overview

Unlock the potential of your electronic systems with the MC10H116DR2G by Onsemi. Known for their superior quality and reliability, Onsemi delivers top-of-the-line Line Drivers & Receivers that are essential for high-speed data transmission in various applications. The MC10H116DR2G stands out with its advanced technology, differential output, and commercial extended temperature grade, providing unmatched performance and efficiency. Trust Onsemi to provide innovative solutions that enhance your system's capabilities and deliver exceptional value to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product reliable for long-term use.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

No. of Functions: 3

Offers versatile functionality and compatibility with various systems and applications.

Power Supplies (V): -5.2

Suitable voltage supply for efficient and reliable performance of the product.

Maximum Operating Temperature: 75 °C

Ensures stable operation even in high-temperature environments, increasing the product's reliability.

Receiver No. of Bits: 3

Provides precise and accurate data transmission, making the product ideal for applications requiring high-quality signal processing.

Technology: ECL

Utilizes ECL technology for high-speed operation and low power consumption, making the product energy-efficient and suitable for data-intensive applications.

Technical Specifications

Line Drivers & Receivers MC10H116DR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

1.3 ns

Receiver No. of Bits:

3

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

23 mA

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10H116DR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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