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MC100E116FNG

Onsemi

MC100E116FNG by Onsemi

MC100E116FNG by Onsemi is a 28-terminal ECL line receiver with 5 functions, operating b/w 0-85 °C. It features differential input characteristics, -4.5 to 5V supply voltage range, and quad terminal position. Ideal for high-speed communication applications requiring precise signal reception.

Median Price

$9.335

Lifecycle Status

EOL

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 37 parts In-Stock

1+ parts

$11.120

100+ parts

$9.580

1k+ parts

$9.580

10k+ parts

$9.580

37

$11.120

$9.580

$9.580

$9.580

Mouser Electronics

USA . 31 parts In-Stock

1+ parts

$11.360

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-

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31

$11.360

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Rochester

USA . 4,371 parts In-Stock

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4,371

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Verical

USA . 4,255 parts In-Stock

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$7.550

1k+ parts

$6.763

10k+ parts

$6.362

4,255

-

$7.550

$6.763

$6.362

Farnell

UK . 116 parts In-Stock

1+ parts

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$6.930

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116

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$6.930

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Distributors (In-Stock)

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Digiode

USA . 1,136 parts In-Stock

1+ parts

$10.564

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1,136

$10.564

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Vyrian

USA . 6,031 parts In-Stock

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6,031

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Flip Electronics

USA . 1,850 parts In-Stock

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1,850

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ComSIT Distribution GmbH

Germany . 109 parts In-Stock

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109

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Connect4Technologies Inc.

Canada . 83 parts In-Stock

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83

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Bristol Electronics

USA . 80 parts In-Stock

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80

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Semi Source

USA . 21 parts In-Stock

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Sunrise Surplus Inc.

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 270 parts In-Stock

1+ parts

$6.930

100+ parts

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270

$6.930

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Corphita

USA . 2,048 parts In-Stock

1+ parts

$10.008

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2,048

$10.008

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QUARKTWIN TECHNOLOGY LTD

USA . 9,883 parts In-Stock

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Microchip USA

USA . 9,374 parts In-Stock

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9,374

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Problanco Electronics

Mexico . 7,726 parts In-Stock

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7,726

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TANS Electronics

Latvia . 3,935 parts In-Stock

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3,935

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Kulean Microsystems

USA . 2,849 parts In-Stock

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2,849

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SupplyDigital Components

Austria . 807 parts In-Stock

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807

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UHIMA Technologies

Türkiye . 699 parts In-Stock

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699

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Perfect Parts

USA . 118 parts In-Stock

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118

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Kepictronics

USA . 86 parts In-Stock

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86

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Overview

Enhance the performance of your communication systems with the MC100E116FNG by Onsemi. As a trusted manufacturer in the industry, Onsemi's line drivers & receivers are known for their top-notch quality and reliability. This product offers customers seamless integration, efficient data transmission, and low power consumption. Ideal for a wide range of applications, the MC100E116FNG ensures smooth operation and enhanced signal integrity. Upgrade your systems today with this advanced technology and experience the difference in performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to external elements, ensuring a longer lifespan for the product.

Surface Mount: YES

Ease of installation and space-saving design make this product suitable for compact electronic applications.

Maximum Supply Voltage: 5.7 V

Allows for versatility in power supply options, accommodating a range of voltage inputs.

No. of Functions: 5

Multiple functions in a single device offer cost-effectiveness and efficiency in circuit design.

Package Shape: SQUARE

Square shape facilitates uniform placement on circuit boards, optimizing space utilization.

Power Supplies (V): -4.5

Supports negative power supply, enhancing flexibility in system configuration.

No. of Terminals: 28

Sufficient terminals for connectivity and interfacing with other components in a complex circuit.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers efficient heat dissipation and compact size for high-density circuit layouts.

Minimum Supply Voltage: 4.2 V

Wide operating voltage range ensures stability and performance under varying power conditions.

Maximum Operating Temperature: 85 °C

High operating temperature tolerance allows for reliable performance in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

Suitable for operation in a wide range of temperature environments, from cold to hot.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for long-lasting connectivity.

Terminal Position: QUAD

Quad terminal layout enables easy soldering and PCB mounting, promoting efficiency in assembly.

Maximum Seated Height: 4.57 mm

Low-profile design for space-constrained applications and efficient heat dissipation.

Width: 11.505 mm

Compact width for easy integration into circuit designs with limited space.

Receiver No. of Bits: 5

5-bit receiver offers sufficient data resolution for accurate signal processing and communication.

Differential Output: YES

Differential output configuration improves noise immunity and signal integrity in high-speed communication systems.

Maximum Time At Peak Reflow Temperature (s): 30

Suitable reflow temperature tolerance for reliable soldering and assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures proper soldering and thermal stability.

Length: 11.505 mm

Compact length for space-efficient placement on circuit boards.

Maximum Receive Delay: 0.45 ns

Low receive delay for minimal signal lag and optimal performance in signal transmission.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, ideal for high-performance applications.

Terminal Form: J BEND

J bend terminal form facilitates easy soldering and secure attachment to PCBs.

Maximum Supply Current: 40 mA

Moderate supply current requirement for efficient power utilization and prolonged battery life.

Input Characteristics: DIFFERENTIAL

Differential input for noise rejection and reliable signal reception in industrial and noisy environments.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage for consistent performance and compatibility with standard power sources.

Nominal Negative Supply Voltage: -4.5 V

Negative supply voltage support for versatility in power options and system integration.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy PCB layout and compatibility with common electronic components.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, suitable for standard storage and handling conditions.

Interface IC Type: LINE RECEIVER

Specifically designed for line receiving applications, ensuring optimal performance and signal reception.

Technical Specifications

Line Drivers & Receivers MC100E116FNG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -4.2V TO -5.7V SUPPLY IN NECL MODE

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

5

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Receive Delay:

.45 ns

Receiver No. of Bits:

5

Maximum Seated Height:

4.57 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.7 V

Minimum Supply Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11.505 mm

Trade Compliance

MC100E116FNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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