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MC10H116DG

Onsemi

MC10H116DG by Onsemi

MC10H116DG by Onsemi is a Line Receiver IC with 3 functions, ECL technology, and -5.2V supply voltage. It operates b/w 0-75°C and has a max receive delay of 1.3ns. Ideal for applications requiring high-speed data transmission in commercial settings.

Median Price

$4.360

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,875 parts In-Stock

1+ parts

$4.070

100+ parts

$3.990

1k+ parts

$3.910

10k+ parts

-

3,875

$4.070

$3.990

$3.910

-

Farnell

UK . 7 parts In-Stock

1+ parts

$4.650

100+ parts

$3.420

1k+ parts

$2.910

10k+ parts

-

7

$4.650

$3.420

$2.910

-

DigiKey

USA . 8,320 parts In-Stock

1+ parts

-

100+ parts

$7.740

1k+ parts

$7.740

10k+ parts

$7.740

8,320

-

$7.740

$7.740

$7.740

Flip Electronics (Authorized)

USA . 7,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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7,720

-

-

-

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Verical

USA . 1,409 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.138

10k+ parts

$2.950

1,409

-

-

$3.138

$2.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 265 parts In-Stock

1+ parts

$2.964

100+ parts

-

1k+ parts

-

10k+ parts

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265

$2.964

-

-

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$5.227

100+ parts

-

1k+ parts

-

10k+ parts

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150

$5.227

-

-

-

DigiKey Marketplace

USA . 11,760 parts In-Stock

1+ parts

-

100+ parts

$9.150

1k+ parts

-

10k+ parts

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11,760

-

$9.150

-

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Vyrian

USA . 5,696 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,696

-

-

-

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Flip Electronics

USA . 610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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610

-

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ComSIT Distribution GmbH

Germany . 336 parts In-Stock

1+ parts

-

100+ parts

-

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336

-

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Bristol Electronics

USA . 17 parts In-Stock

1+ parts

-

100+ parts

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17

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-

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ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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8

-

-

-

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Holdelec - ElecDif-Pro

France . 8 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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8

-

-

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Contempo Components LLC

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Benley Electronics

USA . 33 parts In-Stock

1+ parts

$0.400

100+ parts

-

1k+ parts

-

10k+ parts

-

33

$0.400

-

-

-

Ampacity Inc.

Singapore . 5,415 parts In-Stock

1+ parts

$2.650

100+ parts

-

1k+ parts

-

10k+ parts

-

5,415

$2.650

-

-

-

Corphita

USA . 2,053 parts In-Stock

1+ parts

$2.808

100+ parts

-

1k+ parts

-

10k+ parts

-

2,053

$2.808

-

-

-

Corohmni

South Africa . 257 parts In-Stock

1+ parts

$3.120

100+ parts

-

1k+ parts

-

10k+ parts

-

257

$3.120

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$5.227

100+ parts

$5.122

1k+ parts

-

10k+ parts

-

1,000

$5.227

$5.122

-

-

Semicontronic

India . 5,075 parts In-Stock

1+ parts

$5.770

100+ parts

$5.626

1k+ parts

$5.597

10k+ parts

-

5,075

$5.770

$5.626

$5.597

-

Aztec Data Supply Inc.

USA . 1,987 parts In-Stock

1+ parts

$14.663

100+ parts

-

1k+ parts

-

10k+ parts

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1,987

$14.663

-

-

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Lixinc

USA . 17,000 parts In-Stock

1+ parts

-

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17,000

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-

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Component Stockers USA

USA . 15,908 parts In-Stock

1+ parts

-

100+ parts

$9.020

1k+ parts

$9.020

10k+ parts

$9.020

15,908

-

$9.020

$9.020

$9.020

SupplyDigital Components

Austria . 6,506 parts In-Stock

1+ parts

-

100+ parts

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6,506

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-

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Continental Prestige Electronics

USA . 5,635 parts In-Stock

1+ parts

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100+ parts

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5,635

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-

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Microchip USA

USA . 4,678 parts In-Stock

1+ parts

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4,678

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Argo Parts USA

USA . 4,420 parts In-Stock

1+ parts

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4,420

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-

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Kulean Microsystems

USA . 3,314 parts In-Stock

1+ parts

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100+ parts

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3,314

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-

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Problanco Electronics

Mexico . 2,190 parts In-Stock

1+ parts

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2,190

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-

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TANS Electronics

Latvia . 1,323 parts In-Stock

1+ parts

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100+ parts

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1,323

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-

-

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Perfect Parts

USA . 374 parts In-Stock

1+ parts

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100+ parts

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374

-

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UHIMA Technologies

Türkiye . 293 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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293

-

-

-

-

Overview

Experience the superior quality and reliability of Onsemi with the MC10H116DG Line Driver & Receiver. This innovative product offers seamless communication in a compact package, making it ideal for a wide range of applications. From industrial automation to telecommunications, this versatile component delivers exceptional performance and efficiency. Trust Onsemi to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the MC10H116DG and enjoy the benefits of precision engineering and advanced functionality.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

Surface Mount:

YES - Allows for easy installation on circuit boards.

No. of Functions:

3 - Offers versatility in signal transmission.

Package Shape:

RECTANGULAR - Maximizes space efficiency on PCBs.

Power Supplies (V):

5.2 - Suitable for various power requirements.

No. of Terminals:

16 - Ensures compatibility with different systems.

Package Style (Meter):

SMALL OUTLINE - Ideal for compact electronic devices.

Maximum Operating Temperature:

75 °C - Ensures reliable performance in various environments.

Minimum Operating Temperature:

0 °C - Can withstand a wide range of temperatures.

Terminal Finish:

MATTE TIN - Improves solderability and connectivity.

Terminal Position:

DUAL - Facilitates easy connections in circuit designs.

Maximum Seated Height:

1.75 mm - Allows for slim and space-saving designs.

Width:

3.9 mm - Fits well in tight spaces on PCBs.

Receiver No. of Bits:

3 - Suitable for handling multiple data bits.

Differential Output:

YES - Minimizes signal interference for high-quality transmission.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures reliable soldering during assembly.

Peak Reflow Temperature °C:

260 - Handles high-temperature soldering processes.

Length:

9.9 mm - Provides flexibility in PCB layout designs.

Temperature Grade:

COMMERCIAL EXTENDED - Suitable for industrial applications.

Maximum Receive Delay:

1.3 ns - Ensures fast signal processing.

Technology:

ECL - Offers high-speed and low-power operation.

Terminal Form:

GULL WING - Facilitates secure and reliable connections.

Maximum Supply Current:

23 mA - Suitable for low-power consumption applications.

Input Characteristics:

DIFFERENTIAL - Enhances noise immunity for accurate signal reception.

Nominal Negative Supply Voltage:

5.2 V - Compatible with standard power sources.

Terminal Pitch:

1.27 mm - Allows for easy integration into circuit layouts.

Interface IC Type:

LINE RECEIVER - Designed for efficient signal reception and transmission.

Technical Specifications

Line Drivers & Receivers MC10H116DG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Receive Delay:

1.3 ns

Receiver No. of Bits:

3

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

23 mA

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

MC10H116DG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-601-9114, 5962016019114

NIIN

016019114

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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