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MC100E416FNR2G

Onsemi

MC100E416FNR2G by Onsemi

MC100E416FNR2G by Onsemi is a 28-terminal ECL line receiver with 5 functions, operating at -4.5 to 5.7 V. It features differential output, 0.5 ns max receive delay, and is ideal for high-speed communication applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,526 parts In-Stock

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Digiode

USA . 1,202 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 385 parts In-Stock

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$14.680

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385

$14.680

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Component Stockers USA

USA . 321 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 6,869 parts In-Stock

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SupplyDigital Components

Austria . 6,060 parts In-Stock

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Kulean Microsystems

USA . 4,778 parts In-Stock

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Corphita

USA . 2,171 parts In-Stock

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TANS Electronics

Latvia . 1,839 parts In-Stock

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Microchip USA

USA . 300 parts In-Stock

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UHIMA Technologies

Türkiye . 196 parts In-Stock

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Corohmni

South Africa . 146 parts In-Stock

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Overview

Enhance your electronic designs with the MC100E416FNR2G by Onsemi, a cutting-edge line driver and receiver that delivers exceptional quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this product offers unparalleled performance and efficiency for a wide range of applications. Experience seamless communication and data transmission with this innovative device, designed to meet the needs of modern technology. Elevate your projects with the MC100E416FNR2G and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the package, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, making installation and maintenance convenient.

Maximum Supply Voltage: 5.7 V

Can handle a higher voltage input, providing versatility for different applications.

No. of Functions: 5

With multiple functions, this product offers comprehensive capabilities for signal transmission and reception.

Package Shape: SQUARE

The square shape allows for efficient use of space on a circuit board, optimizing layout and design.

Power Supplies (V): -4.5

Supports a negative supply voltage, enabling compatibility with a wider range of power sources.

No. of Terminals: 28

The ample number of terminals allows for versatile connections and configurations in a circuit.

Package Style (Meter): CHIP CARRIER

The chip carrier style offers compact and reliable packaging for the product, enhancing portability and protection.

Minimum Supply Voltage: 4.2 V

With a low minimum supply voltage requirement, this product is efficient and energy-saving.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, making it suitable for challenging environmental conditions.

Minimum Operating Temperature: 0 °C

Can function in lower temperature environments, ensuring reliability in various operating conditions.

Terminal Finish: TIN

The tin finish provides corrosion resistance and conductivity for reliable signal transmission.

Terminal Position: QUAD

The quad terminal arrangement allows for efficient connection and organization of the product within a circuit.

Maximum Seated Height: 4.57 mm

The low seated height of the package makes it suitable for compact electronic devices and applications with space constraints.

Width: 11.505 mm

The width dimension offers compatibility with standard circuit board layouts and spacing requirements.

Receiver No. of Bits: 5

A 5-bit receiver provides sufficient resolution for accurate data reception and transmission.

Differential Output: YES

Differential output helps reduce noise and interference, ensuring clean and reliable signal transmission.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures during assembly processes, ensuring reliable performance.

Length: 11.505 mm

The length dimension provides a compact form factor, ideal for space-constrained applications.

Maximum Receive Delay: 0.5 ns

With minimal receive delay, this product offers fast and efficient signal reception and processing.

Technology: ECL

ECL technology provides high-speed performance and low power consumption, making it ideal for high-performance applications.

Terminal Form: J BEND

J bend terminals offer secure connections and ease of installation on circuit boards, ensuring reliable operation.

Maximum Supply Current: 186 mA

Capable of handling a relatively high supply current, providing sufficient power for signal transmission and reception.

Input Characteristics: DIFFERENTIAL

Differential input characteristics allow for noise rejection and improved signal integrity, ensuring accurate data transmission.

Nominal Supply Voltage: 5 V

With a stable nominal supply voltage, this product delivers consistent performance in various operating conditions.

Nominal Negative Supply Voltage: -4.5 V

The negative supply voltage supports compatibility with a wide range of power sources, enhancing flexibility in use.

Terminal Pitch: 1.27 mm

The terminal pitch provides compatibility with standard spacing on circuit boards, allowing for easy integration.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product is capable of withstanding moderate exposure to moisture during handling and storage.

Interface IC Type: LINE RECEIVER

Designed specifically as a line receiver, ensuring optimized performance for signal reception in various applications.

Technical Specifications

Line Drivers & Receivers MC100E416FNR2G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -4.2V TO -5.7V SUPPLY IN NECL MODE

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

5

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Receive Delay:

.5 ns

Receiver No. of Bits:

5

Maximum Seated Height:

4.57 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

186 mA

Maximum Supply Voltage:

5.7 V

Minimum Supply Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E416FNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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