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MC100E416FNG

Onsemi

MC100E416FNG by Onsemi

MC100E416FNG by Onsemi is a Line Receiver IC with 5 functions, operating at -4.5 to 5.7 V. It has a quad terminal position and uses ECL technology. Ideal for applications requiring differential input characteristics and peak reflow temperature of 260 °C.

Median Price

$7.729

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,304 parts In-Stock

1+ parts

-

100+ parts

$6.870

1k+ parts

$6.150

10k+ parts

$5.780

1,304

-

$6.870

$6.150

$5.780

Verical

USA . 1,304 parts In-Stock

1+ parts

-

100+ parts

$8.588

1k+ parts

$7.688

10k+ parts

-

1,304

-

$8.588

$7.688

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,710 parts In-Stock

1+ parts

$7.258

100+ parts

-

1k+ parts

-

10k+ parts

-

1,710

$7.258

-

-

-

Vyrian

USA . 2,576 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,576

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 84 parts In-Stock

1+ parts

$6.870

100+ parts

-

1k+ parts

-

10k+ parts

-

84

$6.870

-

-

-

Corphita

USA . 948 parts In-Stock

1+ parts

$6.876

100+ parts

-

1k+ parts

-

10k+ parts

-

948

$6.876

-

-

-

AZTECH Wire

Italy . 1,194 parts In-Stock

1+ parts

$17.820

100+ parts

-

1k+ parts

-

10k+ parts

-

1,194

$17.820

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 17,671 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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17,671

-

-

-

-

Kulean Microsystems

USA . 6,110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,110

-

-

-

-

Microchip USA

USA . 5,514 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,514

-

-

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Problanco Electronics

Mexico . 4,056 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,056

-

-

-

-

TANS Electronics

Latvia . 4,005 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,005

-

-

-

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SupplyDigital Components

Austria . 3,831 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

-

10k+ parts

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3,831

-

-

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Continental Prestige Electronics

USA . 1,304 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,304

-

-

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UHIMA Technologies

Türkiye . 439 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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439

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-

-

Overview

Experience the unparalleled quality and reliability with the MC100E416FNG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge technology in line drivers & receivers, providing seamless connectivity and high-performance solutions for a wide range of applications. With its advanced features and superior design, this product offers exceptional value and benefits to customers, ensuring optimal functionality and efficiency. Trust Onsemi to deliver excellence with the MC100E416FNG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the product, making it resistant to damage.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.7 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing the versatility of the product.

No. of Functions: 5

Having multiple functions within a single device reduces the need for additional components, saving space and cost in the overall system design.

Package Shape: SQUARE

The square package shape is commonly used and easy to handle, making it suitable for various applications and installations.

Power Supplies (V): -4.5

The negative power supply voltage allows for differential signaling, which can improve noise immunity and signal integrity in transmission.

No. of Terminals: 28

The high number of terminals provides flexibility for connecting to external devices and peripherals, enhancing the product's functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is compact and space-saving, ideal for applications where size constraints are a concern.

Minimum Supply Voltage: 4.2 V

The low minimum supply voltage ensures the product can operate efficiently even in low-power scenarios, increasing its reliability.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the product to perform reliably in harsh environmental conditions, ensuring consistent operation.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range ensures the product can function in a wide range of temperature environments, making it versatile for various applications.

Technical Specifications

Line Drivers & Receivers MC100E416FNG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -4.2V TO -5.7V SUPPLY IN NECL MODE

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

5

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Receive Delay:

.5 ns

Receiver No. of Bits:

5

Maximum Seated Height:

4.57 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

186 mA

Maximum Supply Voltage:

5.7 V

Minimum Supply Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100E416FNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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