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MC100EL16MNR4G

Onsemi

MC100EL16MNR4G by Onsemi

MC100EL16MNR4G by Onsemi is a Line Receiver IC with ECL technology. It operates at -40 to 85 °C, with +-5V supplies and 26mA current. With differential output, it has a max receive delay of 0.325ns. Ideal for industrial applications requiring high-speed signal transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,927 parts In-Stock

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Digiode

USA . 598 parts In-Stock

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SupplyDigital Components

Austria . 8,047 parts In-Stock

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Kulean Microsystems

USA . 6,321 parts In-Stock

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TANS Electronics

Latvia . 1,570 parts In-Stock

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Problanco Electronics

Mexico . 701 parts In-Stock

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Corphita

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Corohmni

South Africa . 333 parts In-Stock

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UHIMA Technologies

Türkiye . 12 parts In-Stock

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Overview

Looking for top-notch quality in line drivers & receivers? Look no further than the MC100EL16MNR4G by Onsemi. With a maximum supply voltage of 5.7V and a small outline, very thin profile package style, this industrial-grade technology offers unmatched reliability and performance. Whether you need differential output or input characteristics, this product has got you covered. Trust Onsemi to deliver cutting-edge solutions for your applications. Experience the value and benefits that this product brings to the table and see the difference it can make for your projects.

Feature Benefit Bullets

Surface Mount YES

Easy and convenient installation on circuit boards.

Maximum Supply Voltage 5.7 V

Capable of handling high voltage levels, providing flexibility in power supply options.

Package Shape SQUARE

Compact form factor suitable for space-constrained applications.

Power Supplies (V) +-5

Support for dual power supplies, allowing for versatile power configurations.

No. of Terminals 8

Sufficient number of terminals for connectivity and signal transmission requirements.

Package Style (Meter) SMALL OUTLINE, VERY THIN PROFILE

Low-profile design ideal for applications where space is limited.

Minimum Supply Voltage 4.2 V

Operates reliably even at lower supply voltages, ensuring consistent performance.

Maximum Operating Temperature 85 °C

Suitable for industrial environments with higher temperature ranges.

Minimum Operating Temperature -40 °C

Wide operating temperature range for versatile use in different environmental conditions.

Terminal Finish MATTE TIN

Provides a durable and reliable finish for the terminals, ensuring good connectivity.

Terminal Position DUAL

Dual terminal positioning for enhanced signal transmission capabilities.

Maximum Seated Height 1 mm

Low-profile design for space-saving installation in compact devices.

Width 2 mm

Compact width for easy integration into circuit layouts.

Differential Output YES

Differential output for noise rejection and improved signal integrity.

Length 2 mm

Short length for efficient use of board space.

Temperature Grade INDUSTRIAL

Designed to withstand industrial temperature conditions for reliable performance.

Maximum Receive Delay 0.325 ns

Low receive delay for high-speed data transmission.

Technology ECL

Utilizes Emitter-Coupled Logic technology for high-speed and low-power operation.

Terminal Form NO LEAD

Lead-free terminal form for environmental considerations.

Maximum Supply Current 26 mA

Efficient power consumption with low supply current requirements.

Input Characteristics DIFFERENTIAL

Differential input for noise immunity and signal accuracy.

Nominal Supply Voltage 5 V

Standard voltage level for compatibility with common power sources.

Nominal Negative Supply Voltage -5 V

Supports negative supply voltage for symmetric power configurations.

Terminal Pitch 0.5 mm

Fine terminal pitch for compact layout designs.

Interface IC Type LINE RECEIVER

Specifically designed for line receiver applications, ensuring optimum performance.

Technical Specifications

Line Drivers & Receivers MC100EL16MNR4G attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 VEE=-4.2 TO -5.7

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Length:

2 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Receive Delay:

.325 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

26 mA

Maximum Supply Voltage:

5.7 V

Minimum Supply Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

MC100EL16MNR4G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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