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MC100EL16DT

Onsemi

MC100EL16DT by Onsemi

MC100EL16DT by Onsemi is a Line Receiver IC with ECL technology. It operates at -40 to 85 °C and has a supply voltage range of 4.2-5.7 V. With differential output, it's ideal for industrial applications requiring high-speed signal transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,428 parts In-Stock

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3,428

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Digiode

USA . 1,154 parts In-Stock

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1,154

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Distributors (Availability)

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AZTECH Wire

Italy . 610 parts In-Stock

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$14.250

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610

$14.250

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QUARKTWIN TECHNOLOGY LTD

USA . 7,548 parts In-Stock

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Kulean Microsystems

USA . 6,254 parts In-Stock

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Microchip USA

USA . 4,800 parts In-Stock

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4,800

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TANS Electronics

Latvia . 4,510 parts In-Stock

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4,510

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SupplyDigital Components

Austria . 4,291 parts In-Stock

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Problanco Electronics

Mexico . 2,967 parts In-Stock

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Corphita

USA . 1,933 parts In-Stock

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UHIMA Technologies

Türkiye . 583 parts In-Stock

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Corohmni

South Africa . 322 parts In-Stock

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Overview

Unlock seamless communication with the MC100EL16DT by Onsemi, a top-tier player in the industry. This high-quality line driver/receiver boasts advanced technology and superior performance. Perfect for industrial applications, this compact device offers fast response times and reliable differential outputs. Trust Onsemi for innovative solutions that deliver unmatched value and efficiency to your projects. Experience the difference with the MC100EL16DT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for electronic applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort in manufacturing processes.

Maximum Supply Voltage: 5.7 V

With a high maximum supply voltage, the product can handle a wide range of power input, making it versatile for various applications.

Package Shape: SQUARE

The square package shape provides stability in placement and allows for easy integration into circuit designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions, increasing its reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively in cold environments, enhancing its usability.

Differential Output: YES

The differential output feature helps in reducing electromagnetic interference and noise, ensuring a clean signal transmission.

Technology: ECL

The use of ECL technology ensures high-speed performance and low power consumption, making the product efficient and reliable.

Technical Specifications

Line Drivers & Receivers MC100EL16DT attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC=0 VEE=-4.2 TO -5.7

Differential Output:

YES

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Receive Delay:

.325 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

26 mA

Maximum Supply Voltage:

5.7 V

Minimum Supply Voltage:

4.2 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

MC100EL16DT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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