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MC10EP51MNR4G

Onsemi

MC10EP51MNR4G by Onsemi

MC10EP51MNR4G by Onsemi is a ECL technology latch with 0.37 ns propagation delay, 3.3V supply voltage, and 3000000000 Hz max frequency. Ideal for industrial applications requiring fast signal processing in a compact square package with surface mount capability.

Median Price

$4.208

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 127,120 parts In-Stock

1+ parts

-

100+ parts

$3.740

1k+ parts

$3.350

10k+ parts

$3.150

127,120

-

$3.740

$3.350

$3.150

Verical

USA . 63,879 parts In-Stock

1+ parts

-

100+ parts

$4.675

1k+ parts

$4.188

10k+ parts

$3.938

63,879

-

$4.675

$4.188

$3.938

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 281 parts In-Stock

1+ parts

$3.962

100+ parts

-

1k+ parts

-

10k+ parts

-

281

$3.962

-

-

-

Vyrian

USA . 5,108 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,108

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 387 parts In-Stock

1+ parts

$3.753

100+ parts

-

1k+ parts

-

10k+ parts

-

387

$3.753

-

-

-

Corohmni

South Africa . 252 parts In-Stock

1+ parts

$3.980

100+ parts

-

1k+ parts

-

10k+ parts

-

252

$3.980

-

-

-

AZTECH Wire

Italy . 132 parts In-Stock

1+ parts

$19.060

100+ parts

-

1k+ parts

-

10k+ parts

-

132

$19.060

-

-

-

Continental Prestige Electronics

USA . 129,065 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.540

10k+ parts

-

129,065

-

-

$3.540

-

TANS Electronics

Latvia . 7,971 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,971

-

-

-

-

Microchip USA

USA . 4,251 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,251

-

-

-

-

Problanco Electronics

Mexico . 2,927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,927

-

-

-

-

SupplyDigital Components

Austria . 1,015 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,015

-

-

-

-

UHIMA Technologies

Türkiye . 548 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

548

-

-

-

-

Kulean Microsystems

USA . 374 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

374

-

-

-

-

Overview

Enhance your electronic designs with the MC10EP51MNR4G from Onsemi, a leading manufacturer known for top-quality components. This latches & flip-flops category product offers lightning-fast propagation delay at just 0.37 ns and operates flawlessly with a nominal supply voltage of 3.3V. Perfect for industrial applications, this small-outline package features a very thin profile, making it ideal for space-constrained projects. Trust in Onsemi's expertise and elevate your circuitry with the MC10EP51MNR4G for reliable performance and efficient operation.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.42 ns

Low propagation delay ensures fast operation and high performance of the latch or flip-flop.

Surface Mount: YES

Convenient surface mount option for easy installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage for reliable and efficient operation.

Package Shape: SQUARE

Unique square package shape for compact and space-saving design.

Trigger Type: POSITIVE EDGE

Positive edge trigger type for precise control and triggering of the latch or flip-flop.

Temperature Grade: INDUSTRIAL

Industrial grade temperature range for durability and reliability in harsh environmental conditions.

Technology: ECL

ECL technology for high-speed and low-power consumption performance.

Technical Specifications

Latches & Flip-Flops MC10EP51MNR4G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

JESD-30 Code:

S-XDSO-N8

Length:

2 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

47 mA

Propagation Delay At Nominal Supply:

.42 ns

Propagation Delay (tpd):

.37 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

2 mm

Trade Compliance

MC10EP51MNR4G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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