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MC10EP35DR2G

Onsemi

MC10EP35DR2G by Onsemi

MC10EP35DR2G by Onsemi is a 2-bit ECL flip-flop with 0.49 ns propagation delay, suitable for industrial applications. It operates at -40 to 85 °C, with Vsup ranging from 3V to 5.5V and a max frequency of 3GHz. This small outline package has dual terminals and Gull Wing form factor for surface mounting.

Median Price

$8.134

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,397 parts In-Stock

1+ parts

-

100+ parts

$7.230

1k+ parts

$6.470

10k+ parts

$6.090

12,397

-

$7.230

$6.470

$6.090

Verical

USA . 12,397 parts In-Stock

1+ parts

-

100+ parts

$9.037

1k+ parts

$8.088

10k+ parts

$7.612

12,397

-

$9.037

$8.088

$7.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 531 parts In-Stock

1+ parts

$7.657

100+ parts

-

1k+ parts

-

10k+ parts

-

531

$7.657

-

-

-

Vyrian

USA . 11,120 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,120

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 884 parts In-Stock

1+ parts

$7.254

100+ parts

-

1k+ parts

-

10k+ parts

-

884

$7.254

-

-

-

Corohmni

South Africa . 498 parts In-Stock

1+ parts

$8.060

100+ parts

-

1k+ parts

-

10k+ parts

-

498

$8.060

-

-

-

Component Stockers USA

USA . 17,362 parts In-Stock

1+ parts

$8.220

100+ parts

$7.730

1k+ parts

$6.990

10k+ parts

$6.990

17,362

$8.220

$7.730

$6.990

$6.990

Ampacity Inc.

Singapore . 12,333 parts In-Stock

1+ parts

$14.910

100+ parts

-

1k+ parts

-

10k+ parts

-

12,333

$14.910

-

-

-

AZTECH Wire

Italy . 50 parts In-Stock

1+ parts

$19.450

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$19.450

-

-

-

Continental Prestige Electronics

USA . 12,397 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.840

10k+ parts

-

12,397

-

-

$6.840

-

TANS Electronics

Latvia . 6,302 parts In-Stock

1+ parts

-

100+ parts

-

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6,302

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-

-

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Problanco Electronics

Mexico . 5,698 parts In-Stock

1+ parts

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100+ parts

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5,698

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-

-

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Microchip USA

USA . 5,388 parts In-Stock

1+ parts

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100+ parts

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5,388

-

-

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Kulean Microsystems

USA . 1,675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,675

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-

-

-

UHIMA Technologies

Türkiye . 587 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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587

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SupplyDigital Components

Austria . 71 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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71

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Overview

Enhance your electronic designs with the MC10EP35DR2G by Onsemi! Crafted with precision and expertise, this latches & flip-flops device offers unparalleled reliability and performance. Ideal for a wide range of applications, this product provides customers with exceptional value and benefits. Whether you're looking to optimize your circuitry or enhance your system's functionality, the MC10EP35DR2G is the perfect solution. Trust Onsemi for quality products that deliver superior results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this latch & flip-flop durable and lightweight, ideal for various electronic applications.

Propagation Delay At Nominal Supply: 0.575 ns

The low propagation delay ensures fast switching times, making this latch & flip-flop suitable for high-speed applications where timing is critical.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and making assembly more efficient.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes this latch & flip-flop compatible with a wide range of electronic systems.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures reliable and accurate operation, making this latch & flip-flop suitable for precise timing applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this latch & flip-flop can withstand elevated temperatures, suitable for industrial environments.

Technology: ECL

Utilizing Emitter-Coupled Logic (ECL) technology provides high-speed operation and low power consumption, making this latch & flip-flop efficient for advanced electronics.

Technical Specifications

Latches & Flip-Flops MC10EP35DR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

.575 ns

Propagation Delay (tpd):

.49 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

MC10EP35DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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