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MC10EP17DWG

Onsemi

MC10EP17DWG by Onsemi

MC10EP17DWG by Onsemi is a Line Driver & Receiver with 4 functions, operating at -40 to 85 °C. It has a max transmit delay of 0.3 ns and differential output for industrial applications. The package style is small outline, with dual terminals and Gull Wing form factor.

Median Price

$10.158

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,440 parts In-Stock

1+ parts

-

100+ parts

$9.030

1k+ parts

$8.080

10k+ parts

$7.610

2,440

-

$9.030

$8.080

$7.610

Verical

USA . 339 parts In-Stock

1+ parts

-

100+ parts

$11.287

1k+ parts

$10.100

10k+ parts

$9.512

339

-

$11.287

$10.100

$9.512

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,149 parts In-Stock

1+ parts

$9.566

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-

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2,149

$9.566

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-

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Vyrian

USA . 6,736 parts In-Stock

1+ parts

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6,736

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ACDS - Activité Composants Distribution Service

France . 38 parts In-Stock

1+ parts

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38

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Bristol Electronics

USA . 38 parts In-Stock

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38

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Dan-Mar Components

USA . 38 parts In-Stock

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38

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 397 parts In-Stock

1+ parts

$9.060

100+ parts

-

1k+ parts

-

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397

$9.060

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-

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Corphita

USA . 1,937 parts In-Stock

1+ parts

$9.063

100+ parts

-

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10k+ parts

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1,937

$9.063

-

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AZTECH Wire

Italy . 674 parts In-Stock

1+ parts

$17.340

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674

$17.340

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Problanco Electronics

Mexico . 7,324 parts In-Stock

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SupplyDigital Components

Austria . 6,169 parts In-Stock

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Microchip USA

USA . 3,972 parts In-Stock

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3,972

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Kulean Microsystems

USA . 3,577 parts In-Stock

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3,577

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Continental Prestige Electronics

USA . 2,440 parts In-Stock

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2,440

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TANS Electronics

Latvia . 780 parts In-Stock

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780

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UHIMA Technologies

Türkiye . 592 parts In-Stock

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592

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Overview

Unlock the power of seamless data transmission with the MC10EP17DWG by Onsemi. As a leading manufacturer in line drivers & receivers, Onsemi delivers exceptional quality and reliability in every product. Ideal for industrial applications, this compact device offers quick signal processing, low power consumption, and robust performance even in extreme temperatures. Elevate your system efficiency with the MC10EP17DWG and experience unparalleled value and benefits that will exceed your expectations. Trust Onsemi to provide cutting-edge solutions that drive your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the line driver & receiver, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time during manufacturing.

Maximum Supply Voltage: 5.5 V

A high maximum supply voltage of 5.5V allows for compatibility with a wide range of systems and applications.

No. of Functions: 4

Having 4 functions in one unit reduces the need for additional components, simplifying the overall circuit design and saving space.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easily accommodated on circuit boards, making integration straightforward.

Maximum Transmit Delay: 0.3 ns

A low maximum transmit delay of 0.3ns ensures fast and efficient data transmission, critical for high-speed applications.

Power Supplies (V): +-3.3/+-5

Support for dual power supplies of +-3.3V and +-5V offers flexibility in operating voltage requirements for different systems.

No. of Terminals: 20

With 20 terminals, this line driver & receiver can support multiple connections and interfaces, increasing versatility.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, ideal for compact designs and efficient use of board real estate.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V ensures compatibility with a wide range of power sources, making the product versatile in different applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C allows the line driver & receiver to perform reliably in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C ensures reliable operation even in cold environments, making the product suitable for varied applications.

Terminal Finish: TIN

TIN terminal finish provides good conductivity and corrosion resistance, contributing to the product's overall reliability and durability.

Terminal Position: DUAL

Dual terminal position allows for flexible orientation during installation, accommodating different PCB layouts and assembly requirements.

Maximum Seated Height: 2.65 mm

Low maximum seated height of 2.65mm helps in maintaining a compact overall profile, suitable for applications with space constraints.

Width: 7.5 mm

Narrow width of 7.5mm saves space on the PCB, enabling efficient component placement and enhancing the overall design aesthetics.

Receiver No. of Bits: 4

4 bits in the receiver provide sufficient data processing capability, meeting the needs of various communication protocols and interfaces.

Differential Output: YES

Differential output helps in reducing noise and enhancing signal integrity over long distances, making the product suitable for reliable data transmission.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260 °C ensures secure soldering during assembly, contributing to the overall robustness of the product.

Length: 12.8 mm

Compact length of 12.8mm enables the line driver & receiver to fit easily into tight spaces, suitable for applications with size constraints.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance across a wide range of temperature fluctuations, making the product suitable for industrial applications.

Maximum Receive Delay: 0.3 ns

Low maximum receive delay of 0.3ns ensures prompt reception of signals, essential for real-time data applications where timing is critical.

Technology: ECL

ECL (Emitter-Coupled Logic) technology offers high-speed operation and low propagation delay, making the product suitable for demanding signal processing tasks.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections, ensuring reliable electrical contact and mechanical stability.

Maximum Supply Current: 68 mA

Moderate maximum supply current of 68mA ensures efficient power consumption, suitable for applications where power efficiency is a priority.

Input Characteristics: DIFFERENTIAL

Differential input characteristics help in noise rejection and signal accuracy, making the product suitable for applications where signal integrity is crucial.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3V provides stable power delivery for the line driver & receiver, ensuring consistent and reliable performance.

Terminal Pitch: 1.27 mm

Narrow terminal pitch of 1.27mm enables compact PCB layout and efficient routing of connections, contributing to overall design efficiency.

Driver No. of Bits: 4

4 bits in the driver offer sufficient data processing capability, facilitating complex signal manipulation and transmission.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures during storage and assembly to maintain product reliability.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type allows for seamless communication between different systems and components, ensuring compatibility and interoperability.

Technical Specifications

Line Drivers & Receivers MC10EP17DWG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

4

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-3.3/+-5

Qualification:

Not Qualified

Maximum Receive Delay:

.3 ns

Receiver No. of Bits:

4

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

68 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

.3 ns

Width:

7.5 mm

Trade Compliance

MC10EP17DWG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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