Loading...

MC10EP131FAR2

Onsemi

MC10EP131FAR2 by Onsemi

MC10EP131FAR2 by Onsemi is a 4-bit ECL flip-flop with 0.6 ns propagation delay. Operating at -40 to 85 °C, it has a max frequency of 3 GHz and supports Vsup from 3V to 5.5V. Ideal for industrial applications requiring fast signal processing in compact spaces.

Median Price

$13.511

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$12.010

1k+ parts

$10.740

10k+ parts

$10.110

4,000

-

$12.010

$10.740

$10.110

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$15.012

1k+ parts

$13.425

10k+ parts

-

4,000

-

$15.012

$13.425

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,037 parts In-Stock

1+ parts

$12.692

100+ parts

-

1k+ parts

-

10k+ parts

-

2,037

$12.692

-

-

-

Vyrian

USA . 12,073 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,073

-

-

-

-

4 Star Electronics, Inc.

USA . 1,580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,580

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,594 parts In-Stock

1+ parts

$10.850

100+ parts

-

1k+ parts

-

10k+ parts

-

3,594

$10.850

-

-

-

Corphita

USA . 2,030 parts In-Stock

1+ parts

$12.024

100+ parts

-

1k+ parts

-

10k+ parts

-

2,030

$12.024

-

-

-

Corohmni

South Africa . 139 parts In-Stock

1+ parts

$12.760

100+ parts

-

1k+ parts

-

10k+ parts

-

139

$12.760

-

-

-

Component Stockers USA

USA . 3,028 parts In-Stock

1+ parts

$13.560

100+ parts

$12.740

1k+ parts

$11.520

10k+ parts

-

3,028

$13.560

$12.740

$11.520

-

AZTECH Wire

Italy . 290 parts In-Stock

1+ parts

$21.370

100+ parts

-

1k+ parts

-

10k+ parts

-

290

$21.370

-

-

-

SupplyDigital Components

Austria . 6,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,600

-

-

-

-

Continental Prestige Electronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$11.340

10k+ parts

-

4,000

-

-

$11.340

-

TANS Electronics

Latvia . 2,826 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,826

-

-

-

-

Kulean Microsystems

USA . 2,723 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,723

-

-

-

-

Kepictronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Problanco Electronics

Mexico . 1,412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,412

-

-

-

-

UHIMA Technologies

Türkiye . 975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

975

-

-

-

-

Microchip USA

USA . 210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

210

-

-

-

-

Overview

Unlock unparalleled performance with the MC10EP131FAR2 by Onsemi. As a leader in the industry, Onsemi delivers top-notch quality and reliability, making this latch & flip-flop an essential component for high-speed applications. Its cutting-edge technology ensures optimal functionality while its compact design allows for seamless integration. Experience lightning-fast response times and precision with the MC10EP131FAR2, setting you apart from the competition. Elevate your projects with this superior product that offers unmatched value and benefits to meet all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the latch or flip-flop, making it suitable for various industrial applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during the manufacturing process.

No. of Bits: 4

Having 4 bits allows for more complex operations and data processing capabilities, making this latch or flip-flop versatile for different applications.

Propagation Delay (tpd): 0.6 ns

The very low propagation delay of 0.6 ns ensures fast data processing and response times, which is crucial for high-speed applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade means this latch or flip-flop can withstand a wide range of temperatures, making it suitable for harsh operating environments.

Maximum Frequency At Nominal Supply: 3000000000 Hz

The high maximum frequency at nominal supply allows for high-speed operation and data processing, ideal for applications requiring quick response times.

Technical Specifications

Latches & Flip-Flops MC10EP131FAR2 attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

10E

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e0

Length:

7 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

120 mA

Propagation Delay (tpd):

.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trigger Type:

POSITIVE EDGE

Width:

7 mm

Trade Compliance

MC10EP131FAR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20