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MC10E167FNR2G

Onsemi

MC10E167FNR2G by Onsemi

MC10E167FNR2G by Onsemi is a 6-bit ECL flip-flop with 0.8 ns propagation delay, suitable for high-speed applications. Operating at 5V, it has a max frequency of 1GHz and trigger type as positive edge. With a package style of chip carrier, it is ideal for fast data processing in electronic systems.

Median Price

$6.480

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,130 parts In-Stock

1+ parts

$6.480

100+ parts

$6.100

1k+ parts

$5.510

10k+ parts

-

4,130

$6.480

$6.100

$5.510

-

Farnell

UK . 4,130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.350

10k+ parts

-

4,130

-

-

$5.350

-

Verical

USA . 2,130 parts In-Stock

1+ parts

-

100+ parts

$6.938

1k+ parts

$6.200

10k+ parts

$5.838

2,130

-

$6.938

$6.200

$5.838

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,297 parts In-Stock

1+ parts

$5.871

100+ parts

-

1k+ parts

-

10k+ parts

-

1,297

$5.871

-

-

-

Vyrian

USA . 3,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,520

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 274 parts In-Stock

1+ parts

$5.350

100+ parts

-

1k+ parts

-

10k+ parts

-

274

$5.350

-

-

-

Corphita

USA . 1,646 parts In-Stock

1+ parts

$5.562

100+ parts

-

1k+ parts

-

10k+ parts

-

1,646

$5.562

-

-

-

Component Stockers USA

USA . 3,709 parts In-Stock

1+ parts

$6.400

100+ parts

$6.020

1k+ parts

$5.440

10k+ parts

-

3,709

$6.400

$6.020

$5.440

-

AZTECH Wire

Italy . 958 parts In-Stock

1+ parts

$15.700

100+ parts

-

1k+ parts

-

10k+ parts

-

958

$15.700

-

-

-

SupplyDigital Components

Austria . 6,683 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,683

-

-

-

-

Microchip USA

USA . 6,530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,530

-

-

-

-

Continental Prestige Electronics

USA . 4,130 parts In-Stock

1+ parts

-

100+ parts

$5.350

1k+ parts

-

10k+ parts

-

4,130

-

$5.350

-

-

Problanco Electronics

Mexico . 3,785 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,785

-

-

-

-

TANS Electronics

Latvia . 3,663 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,663

-

-

-

-

Kulean Microsystems

USA . 2,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,305

-

-

-

-

UHIMA Technologies

Türkiye . 86 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

86

-

-

-

-

Overview

Elevate your electronic designs to new heights with the MC10E167FNR2G by Onsemi. As a trusted leader in the industry, Onsemi delivers top-quality latches & flip-flops that guarantee reliability and superior performance. Ideal for a wide range of applications, this product offers lightning-fast propagation delay, ensuring seamless operation. With a nominal supply voltage of 5V and a maximum operating temperature of 85 °C, the MC10E167FNR2G is a versatile solution for your circuit needs. Trust Onsemi to provide cutting-edge technology that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for internal components.

Propagation Delay At Nominal Supply: 0.8 ns

Allows for fast and efficient operation.

Surface Mount: YES

Enables easy and convenient installation on circuit boards.

No. of Inputs: 2

Provides flexibility for input signals.

Package Shape: SQUARE

Saves space on the circuit board.

No. of Bits: 6

Offers multiple output options.

Nominal Supply Voltage / Vsup: 5 V

Standard voltage for most applications.

Power Supplies (V): -5.2

Compatible with various power sources.

No. of Terminals: 28

Provides ample connection points.

Package Style (Meter): CHIP CARRIER

Easy to handle and install in electronic systems.

Propagation Delay (tpd): 1.05 ns

Efficient signal processing capabilities.

Maximum Operating Temperature: 85 °C

Suitable for a wide range of operating environments.

Output Characteristics: OPEN-EMITTER

Allows for versatile output configurations.

Trigger Type: POSITIVE EDGE

Responsive to positive-edge signals for precise timing.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature conditions.

Terminal Finish: TIN

Provides corrosion resistance for terminals.

Terminal Position: QUAD

Optimal arrangement for stable connections.

Maximum Seated Height: 4.57 mm

Compatible with compact designs.

Width: 11.505 mm

Compact form factor for space-efficient installations.

Output Polarity: TRUE

Provides accurate output signals.

Minimum Supply Voltage (Vsup): 4.2 V

Can operate at low voltage levels.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly.

Peak Reflow Temperature °C: 260

Withstands high-temperature soldering processes.

Length: 11.505 mm

Compact size for space-constrained installations.

Maximum Frequency At Nominal Supply: 1000000000 Hz

Supports high-frequency signal processing.

Technology: ECL

Utilizes Emitter-Coupled Logic for high-speed operations.

Terminal Form: J BEND

Facilitates easy insertion and removal from the circuit board.

Packing Method: TR

Secure packaging for transportation and storage.

Terminal Pitch: 1.27 mm

Standard pitch for easy connection with other components.

Minimum fmax: 1000 MHz

Supports high-frequency operation.

Moisture Sensitivity Level (MSL): 3

Suitable for various environmental conditions.

Maximum Supply Voltage (Vsup): 5.7 V

Can handle higher supply voltages when required.

Maximum Power Supply Current (ICC): 113 mA

Efficient power consumption for energy savings.

Technical Specifications

Latches & Flip-Flops MC10E167FNR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

10E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

1000000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

6

No. of Functions:

1

No. of Inputs:

2

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Maximum Power Supply Current (ICC):

113 mA

Propagation Delay At Nominal Supply:

.8 ns

Propagation Delay (tpd):

1.05 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

11.505 mm

Minimum fmax:

1000 MHz

Trade Compliance

MC10E167FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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