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MC100EP52DTR2

Onsemi

MC100EP52DTR2 by Onsemi

MC100EP52DTR2 by Onsemi is a ECL technology latch with 0.38 ns propagation delay, 3.3V nominal voltage, and 4000000000 Hz max frequency. It is used in industrial applications for positive edge triggering with a temperature range of -40 to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,879 parts In-Stock

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3,879

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Digiode

USA . 1,235 parts In-Stock

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1,235

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Distributors (Availability)

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AZTECH Wire

Italy . 132 parts In-Stock

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$11.880

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132

$11.880

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$33.189

100+ parts

$30.202

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$27.215

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5,000

$33.189

$30.202

$27.215

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Problanco Electronics

Mexico . 4,700 parts In-Stock

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4,700

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Kulean Microsystems

USA . 4,458 parts In-Stock

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4,458

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TANS Electronics

Latvia . 2,114 parts In-Stock

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Corphita

USA . 1,633 parts In-Stock

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1,633

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SupplyDigital Components

Austria . 996 parts In-Stock

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UHIMA Technologies

Türkiye . 312 parts In-Stock

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Corohmni

South Africa . 220 parts In-Stock

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220

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Microchip USA

USA . 198 parts In-Stock

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Overview

Discover the MC100EP52DTR2 by Onsemi, a top-quality latch and flip-flop device designed to deliver superior performance in industrial applications. With a wide temperature range and high-speed operation, this product offers reliable functionality in demanding environments. Onsemi's dedication to excellence ensures that customers receive a precise and efficient solution for their needs. Trust the MC100EP52DTR2 to provide seamless operation and unmatched value, making it an essential component for your projects. Elevate your designs with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the latch or flip-flop easy to handle and long-lasting.

Propagation Delay At Nominal Supply: 0.41 ns

With a very low propagation delay, this latch or flip-flop can quickly respond to input changes, ensuring efficient operation.

Surface Mount: YES

Being surface mountable makes it easy to integrate this latch or flip-flop into PCBs, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard supply voltage of 3.3V allows compatibility with many existing systems and power sources.

Minimum Operating Temperature: -40 °C

With a wide temperature range of -40 to 85 °C, this latch or flip-flop can function reliably in various environmental conditions.

Technology: ECL

Using ECL technology ensures high-speed operation and low power consumption, making this latch or flip-flop suitable for high-performance applications.

Technical Specifications

Latches & Flip-Flops MC100EP52DTR2 attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e0

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

4000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

47 mA

Propagation Delay At Nominal Supply:

.41 ns

Propagation Delay (tpd):

.38 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Trade Compliance

MC100EP52DTR2 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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