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MC100EP451MNG

Onsemi

MC100EP451MNG by Onsemi

MC100EP451MNG by Onsemi is a 6-bit latch with 0.55 ns propagation delay, ideal for industrial applications. Operating at -40 to 85 °C, it supports a frequency of 3 GHz and requires Vsup b/w 3-5.5V. With positive edge trigger type, this ECL technology chip carrier suits high-speed digital systems.

Median Price

$17.975

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2 parts In-Stock

1+ parts

$23.960

100+ parts

$16.190

1k+ parts

$15.950

10k+ parts

-

2

$23.960

$16.190

$15.950

-

Chip1Stop

Japan . 3 parts In-Stock

1+ parts

$53.800

100+ parts

-

1k+ parts

-

10k+ parts

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3

$53.800

-

-

-

Flip Electronics (Authorized)

USA . 24,864 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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24,864

-

-

-

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DigiKey

USA . 8,288 parts In-Stock

1+ parts

-

100+ parts

$16.320

1k+ parts

-

10k+ parts

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8,288

-

$16.320

-

-

Rochester

USA . 5,655 parts In-Stock

1+ parts

-

100+ parts

$14.380

1k+ parts

$12.870

10k+ parts

$12.110

5,655

-

$14.380

$12.870

$12.110

Verical

USA . 3,313 parts In-Stock

1+ parts

-

100+ parts

$17.975

1k+ parts

$16.087

10k+ parts

$15.137

3,313

-

$17.975

$16.087

$15.137

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 726 parts In-Stock

1+ parts

$15.172

100+ parts

-

1k+ parts

-

10k+ parts

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726

$15.172

-

-

-

Flip Electronics

USA . 13,246 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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13,246

-

-

-

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Vyrian

USA . 4,773 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,773

-

-

-

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Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,040 parts In-Stock

1+ parts

$13.570

100+ parts

-

1k+ parts

-

10k+ parts

-

6,040

$13.570

-

-

-

Corphita

USA . 81 parts In-Stock

1+ parts

$14.373

100+ parts

-

1k+ parts

-

10k+ parts

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81

$14.373

-

-

-

Corohmni

South Africa . 396 parts In-Stock

1+ parts

$15.970

100+ parts

-

1k+ parts

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10k+ parts

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396

$15.970

-

-

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Microchip USA

USA . 1,604 parts In-Stock

1+ parts

$54.119

100+ parts

-

1k+ parts

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10k+ parts

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1,604

$54.119

-

-

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SupplyDigital Components

Austria . 6,815 parts In-Stock

1+ parts

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100+ parts

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6,815

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TANS Electronics

Latvia . 5,273 parts In-Stock

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5,273

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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100+ parts

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5,000

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Kulean Microsystems

USA . 4,341 parts In-Stock

1+ parts

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4,341

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QUARKTWIN TECHNOLOGY LTD

USA . 4,096 parts In-Stock

1+ parts

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4,096

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Problanco Electronics

Mexico . 2,424 parts In-Stock

1+ parts

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2,424

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Continental Prestige Electronics

USA . 1,824 parts In-Stock

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1,824

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Argo Parts USA

USA . 741 parts In-Stock

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741

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Kepictronics

USA . 245 parts In-Stock

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245

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UHIMA Technologies

Türkiye . 111 parts In-Stock

1+ parts

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111

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GreenTree Electronics

Israel . 103 parts In-Stock

1+ parts

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103

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Aranea Global

USA . 100 parts In-Stock

1+ parts

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100+ parts

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100

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Overview

Unlock the power of advanced latches and flip-flops with the MC100EP451MNG by Onsemi. Crafted with precision and quality, this innovative product offers unparalleled reliability and performance in a wide range of applications. From industrial automation to telecommunications, this chip carrier is designed to exceed expectations. With a low propagation delay and high maximum frequency, customers can expect seamless operation and optimal efficiency. Elevate your projects with the cutting-edge technology of the MC100EP451MNG and experience the difference Onsemi brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this latch or flip-flop lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and space.

No. of Bits: 6

With 6 bits, this latch or flip-flop can handle and store a decent amount of data, making it suitable for various applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V makes this latch or flip-flop energy efficient and compatible with a wide range of electronic systems.

Propagation Delay (tpd): 0.55 ns

The low propagation delay of 0.55 ns ensures fast and efficient data processing, making this latch or flip-flop ideal for high-speed applications.

Trigger Type: POSITIVE EDGE

The positive edge trigger type ensures precise and reliable data capture, enhancing the overall performance of this latch or flip-flop.

Maximum Frequency At Nominal Supply: 3000000000 Hz

With a maximum frequency of 3 GHz at nominal supply voltage, this latch or flip-flop is capable of handling high-speed signals and data processing tasks.

Technology: ECL

Utilizing ECL technology offers high-speed operation and low power consumption, making this latch or flip-flop suitable for demanding applications.

Technical Specifications

Latches & Flip-Flops MC100EP451MNG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Count Direction:

RIGHT

Family:

100E

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay (tpd):

.55 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5 mm

Trade Compliance

MC100EP451MNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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