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MC100EP35DR2G

Onsemi

MC100EP35DR2G by Onsemi

MC100EP35DR2G by Onsemi is a 2-bit ECL latch with 0.49 ns propagation delay, suitable for industrial applications. It operates at 3.3V with -4.5V power supplies, offering a max frequency of 3GHz. With positive edge trigger and complementary output polarity, it is ideal for high-speed digital systems requiring fast signal processing.

Median Price

$8.134

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

$7.230

1k+ parts

$6.470

10k+ parts

$6.090

15,000

-

$7.230

$6.470

$6.090

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

$9.037

1k+ parts

$8.088

10k+ parts

$7.612

15,000

-

$9.037

$8.088

$7.612

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 912 parts In-Stock

1+ parts

$7.657

100+ parts

-

1k+ parts

-

10k+ parts

-

912

$7.657

-

-

-

Vyrian

USA . 5,033 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,033

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 14,974 parts In-Stock

1+ parts

$6.850

100+ parts

-

1k+ parts

-

10k+ parts

-

14,974

$6.850

-

-

-

Corphita

USA . 1,591 parts In-Stock

1+ parts

$7.254

100+ parts

-

1k+ parts

-

10k+ parts

-

1,591

$7.254

-

-

-

Corohmni

South Africa . 162 parts In-Stock

1+ parts

$8.060

100+ parts

-

1k+ parts

-

10k+ parts

-

162

$8.060

-

-

-

Component Stockers USA

USA . 16,814 parts In-Stock

1+ parts

$8.140

100+ parts

$7.660

1k+ parts

$6.920

10k+ parts

$6.920

16,814

$8.140

$7.660

$6.920

$6.920

AZTECH Wire

Italy . 1,167 parts In-Stock

1+ parts

$11.370

100+ parts

-

1k+ parts

-

10k+ parts

-

1,167

$11.370

-

-

-

Continental Prestige Electronics

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.840

10k+ parts

-

15,000

-

-

$6.840

-

TANS Electronics

Latvia . 6,807 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,807

-

-

-

-

SupplyDigital Components

Austria . 6,488 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,488

-

-

-

-

Kulean Microsystems

USA . 1,626 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,626

-

-

-

-

Problanco Electronics

Mexico . 659 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

659

-

-

-

-

Microchip USA

USA . 339 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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339

-

-

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UHIMA Technologies

Türkiye . 325 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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325

-

-

-

-

Overview

Unlock unparalleled performance with the MC100EP35DR2G by Onsemi. This state-of-the-art latch & flip-flop device offers lightning-fast propagation delay at a nominal supply, making it perfect for high-speed applications. With a durable plastic/epoxy package body and a wide operating temperature range, this product ensures reliability in any environment. Trust Onsemi's expertise in semiconductor manufacturing to deliver top-notch quality and innovation. Take your projects to the next level with the MC100EP35DR2G and experience the difference in speed, efficiency, and precision.

Feature Benefit Bullets

Propagation Delay At Nominal Supply

Fast propagation delay ensures quick response time for latch operations.

Surface Mount

Surface mount capability allows for easy and efficient PCB assembly.

No. of Bits

Having 2 bits provides flexibility in the input/output combinations.

Nominal Supply Voltage / Vsup (V)

Optimal supply voltage for efficient performance and power consumption.

Maximum Frequency At Nominal Supply

High maximum frequency allows for high-speed latch and flip-flop operations.

Technical Specifications

Latches & Flip-Flops MC100EP35DR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.9 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

50 mA

Propagation Delay At Nominal Supply:

.575 ns

Propagation Delay (tpd):

.49 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3.9 mm

Trade Compliance

MC100EP35DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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