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MC100EP31DTR2G

Onsemi

MC100EP31DTR2G by Onsemi

MC100EP31DTR2G by Onsemi is a square-shaped latch with 8 terminals, operating at -40 to 85 °C. It has a propagation delay of 0.41 ns and supports a max frequency of 3 GHz. Ideal for industrial applications requiring positive edge triggering and complementary output polarity.

Median Price

$4.770

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,288 parts In-Stock

1+ parts

$4.770

100+ parts

$4.670

1k+ parts

$4.580

10k+ parts

-

4,288

$4.770

$4.670

$4.580

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 513 parts In-Stock

1+ parts

$4.532

100+ parts

-

1k+ parts

-

10k+ parts

-

513

$4.532

-

-

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Vyrian

USA . 7,086 parts In-Stock

1+ parts

-

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7,086

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Distributors (Availability)

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Corphita

USA . 100 parts In-Stock

1+ parts

$4.293

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$4.293

-

-

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Corohmni

South Africa . 336 parts In-Stock

1+ parts

$4.770

100+ parts

-

1k+ parts

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336

$4.770

-

-

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AZTECH Wire

Italy . 362 parts In-Stock

1+ parts

$21.920

100+ parts

-

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362

$21.920

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Microchip USA

USA . 5,563 parts In-Stock

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5,563

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Kulean Microsystems

USA . 3,943 parts In-Stock

1+ parts

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3,943

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Problanco Electronics

Mexico . 2,825 parts In-Stock

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2,825

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TANS Electronics

Latvia . 2,821 parts In-Stock

1+ parts

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2,821

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SupplyDigital Components

Austria . 996 parts In-Stock

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996

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UHIMA Technologies

Türkiye . 319 parts In-Stock

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319

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Overview

Discover the unparalleled performance and reliability of the MC100EP31DTR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality latches & flip-flops that are perfect for a wide range of applications. With a nominal supply voltage of 3.3V and a maximum frequency of 3GHz, this product offers exceptional value and benefits to customers seeking high-speed operation and precise timing control. Experience the advantages of industrial-grade technology and innovative design with the MC100EP31DTR2G, where quality meets functionality seamlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides durability and resistance to environmental factors, making the latch reliable for long-term use.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a low nominal supply voltage, making it energy-efficient and cost-effective.

Propagation Delay (tpd): 0.41 ns

Low propagation delay ensures fast and accurate data processing, suitable for high-speed applications.

Trigger Type: POSITIVE EDGE

Positive edge trigger type ensures precise timing and synchronization of signals, enhancing overall performance.

Maximum Frequency At Nominal Supply: 3000000000 Hz

High maximum frequency capability allows for rapid signal processing, making it suitable for high-frequency applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation in various environmental conditions, increasing the product's versatility.

Technical Specifications

Latches & Flip-Flops MC100EP31DTR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3.0V TO -5.5V

Family:

100E

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

3000000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

47 mA

Propagation Delay (tpd):

.41 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

3 mm

Trade Compliance

MC100EP31DTR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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