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MC100EP29MNTXG

Onsemi

MC100EP29MNTXG by Onsemi

MC100EP29MNTXG by Onsemi is a 20-terminal ECL chip with 2 functions, operating at -40 to 85 °C. It has a propagation delay of 0.5 ns and supports a supply voltage range of 3V to 5.5V. Ideal for industrial applications requiring fast positive edge triggering in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 7,679 parts In-Stock

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Digiode

USA . 436 parts In-Stock

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436

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AZTECH Wire

Italy . 471 parts In-Stock

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$17.830

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471

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Component Stockers USA

USA . 747 parts In-Stock

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$99.990

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Microchip USA

USA . 5,367 parts In-Stock

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SupplyDigital Components

Austria . 3,088 parts In-Stock

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Kepictronics

USA . 3,021 parts In-Stock

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Kulean Microsystems

USA . 2,093 parts In-Stock

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Problanco Electronics

Mexico . 1,802 parts In-Stock

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Corphita

USA . 1,450 parts In-Stock

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TANS Electronics

Latvia . 916 parts In-Stock

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Corohmni

South Africa . 137 parts In-Stock

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UHIMA Technologies

Türkiye . 133 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the MC100EP29MNTXG by Onsemi. This high-quality latches & flip-flops component offers unparalleled reliability and precision, making it perfect for a wide range of applications. With its advanced technology and industrial-grade construction, this product provides customers with exceptional value, benefits, and advantages that will elevate their projects to the next level. Trust Onsemi for top-notch performance and innovation in every component.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and space-efficient integration into electronic circuits.

No. of Functions: 2

Having multiple functions in one component offers efficiency and reduces the need for additional parts.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common supply voltage, ensuring compatibility with many systems.

Package Shape: SQUARE

Square package shape is versatile and can fit well into various circuit layouts.

Propagation Delay (tpd): 0.5 ns

Low propagation delay allows for fast switching and efficient operation.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows for reliable performance in various environments.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures durability during assembly processes.

Technology: ECL

ECL technology offers high speed and low power consumption, making it suitable for demanding applications.

Technical Specifications

Latches & Flip-Flops MC100EP29MNTXG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V

Family:

100E

JESD-30 Code:

S-XQCC-N20

JESD-609 Code:

e3

Length:

4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Propagation Delay (tpd):

.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

4 mm

Trade Compliance

MC100EP29MNTXG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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