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MC100EP16VCD

Onsemi

MC100EP16VCD by Onsemi

MC100EP16VCD by Onsemi is a Line Transceiver with ECL technology. It operates at -40 to 85 °C, with 3-5.5 V supply voltage range and 0.4 ns transmit/receive delay. Ideal for industrial applications requiring differential input/output characteristics in a compact SMD package.

Median Price

$2.001

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,413 parts In-Stock

1+ parts

-

100+ parts

$1.890

1k+ parts

$1.690

10k+ parts

$1.590

2,413

-

$1.890

$1.690

$1.590

Verical

USA . 1,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.112

10k+ parts

$1.988

1,950

-

-

$2.112

$1.988

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,926 parts In-Stock

1+ parts

$2.090

100+ parts

-

1k+ parts

-

10k+ parts

-

1,926

$2.090

-

-

-

Vyrian

USA . 3,554 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,554

-

-

-

-

R&J Components

USA . 39 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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39

-

-

-

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Prism Electronics

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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20

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 426 parts In-Stock

1+ parts

$1.890

100+ parts

-

1k+ parts

-

10k+ parts

-

426

$1.890

-

-

-

Corphita

USA . 1,828 parts In-Stock

1+ parts

$1.980

100+ parts

-

1k+ parts

-

10k+ parts

-

1,828

$1.980

-

-

-

Component Stockers USA

USA . 2,647 parts In-Stock

1+ parts

$2.130

100+ parts

$2.000

1k+ parts

$1.810

10k+ parts

-

2,647

$2.130

$2.000

$1.810

-

AZTECH Wire

Italy . 41 parts In-Stock

1+ parts

$8.310

100+ parts

-

1k+ parts

-

10k+ parts

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41

$8.310

-

-

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SupplyDigital Components

Austria . 5,327 parts In-Stock

1+ parts

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100+ parts

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5,327

-

-

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Kulean Microsystems

USA . 4,492 parts In-Stock

1+ parts

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4,492

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-

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TANS Electronics

Latvia . 2,421 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,421

-

-

-

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Continental Prestige Electronics

USA . 2,413 parts In-Stock

1+ parts

-

100+ parts

$1.890

1k+ parts

-

10k+ parts

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2,413

-

$1.890

-

-

RC Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,000

-

-

-

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Problanco Electronics

Mexico . 1,828 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,828

-

-

-

-

UHIMA Technologies

Türkiye . 700 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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700

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Microchip USA

USA . 367 parts In-Stock

1+ parts

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367

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Perfect Parts

USA . 22 parts In-Stock

1+ parts

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1k+ parts

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22

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Overview

Unlock the power of high-speed data transmission with the MC100EP16VCD by Onsemi. This line driver & receiver offers unparalleled quality and reliability, backed by the reputable manufacturer Onsemi. Ideal for industrial applications, this versatile product delivers fast signal processing and superior performance. With a compact design and efficient power consumption, the MC100EP16VCD provides exceptional value to customers looking for top-of-the-line technology. Upgrade your systems with this innovative solution and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the device.

Surface Mount: YES

Facilitates easy installation on circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

Enables efficient placement on circuit boards and utilization of space.

Maximum Transmit Delay: 0.4 ns

Ensures fast and reliable signal transmission.

Power Supplies (V): -4.5

Provides a stable power source for consistent operation of the device.

No. of Terminals: 8

Offers multiple connection points for enhanced functionality.

Package Style (Meter): SMALL OUTLINE

Allows for compact design and integration into various electronic systems.

Maximum High Level Input Current: 0.00015 Amp

Efficiently handles input current levels for smooth signal processing.

Minimum Supply Voltage: 3 V

Works with low voltage power sources for energy efficiency.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Allows for operation in extreme cold environments without compromising functionality.

Terminal Finish: TIN LEAD

Provides a reliable and conductive finish for the terminal connections.

Terminal Position: DUAL

Offers flexibility in connecting to external devices or circuitry.

Maximum Seated Height: 1.75 mm

Contributes to the compact and low-profile design of the device.

Width: 3.9 mm

Compact width allows for easy integration into tight spaces.

Differential Output: YES

Provides balanced output signals for improved noise immunity and signal integrity.

Peak Reflow Temperature °C: 235

Withstands high temperatures during manufacturing processes for reliable soldering.

Length: 4.9 mm

Optimal length for fitting into standard circuit board layouts.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with extended temperature ranges and harsh conditions.

Maximum Receive Delay: 0.4 ns

Ensures minimal delay in receiving signals for efficient data transmission.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed and low-power signal processing.

Terminal Form: GULL WING

Provides a secure and reliable connection to the circuit board.

Maximum Supply Current: 38 mA

Operates efficiently with a low current requirement.

Input Characteristics: DIFFERENTIAL

Accepts differential input signals for improved noise rejection and signal accuracy.

Nominal Supply Voltage: 3.3 V

Standard voltage level for consistent and reliable performance.

Nominal Negative Supply Voltage: -4.5 V

Provides a stable negative power supply for proper device operation.

Terminal Pitch: 1.27 mm

Standard spacing for easy connection to other components or circuits.

Interface IC Type: LINE TRANSCEIVER

Specifically designed for transmitting and receiving signals between communication lines.

Technical Specifications

Line Drivers & Receivers MC100EP16VCD attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00015 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Receive Delay:

.4 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

38 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

.4 ns

Width:

3.9 mm

Trade Compliance

MC100EP16VCD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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