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MC100EP116MNG

Onsemi

MC100EP116MNG by Onsemi

MC100EP116MNG by Onsemi is a Line Transceiver with 6-bit driver and receiver. It operates at -40 to 85 °C, with supply voltage range of 3-5.5V. Ideal for industrial applications requiring ECL technology and differential input characteristics.

Median Price

$14.392

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 324 parts In-Stock

1+ parts

$41.900

100+ parts

$26.600

1k+ parts

-

10k+ parts

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324

$41.900

$26.600

-

-

Rochester

USA . 20,502 parts In-Stock

1+ parts

-

100+ parts

$11.220

1k+ parts

$10.040

10k+ parts

$9.450

20,502

-

$11.220

$10.040

$9.450

DigiKey

USA . 20,502 parts In-Stock

1+ parts

-

100+ parts

$14.760

1k+ parts

-

10k+ parts

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20,502

-

$14.760

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Verical

USA . 10,364 parts In-Stock

1+ parts

-

100+ parts

$14.025

1k+ parts

$12.550

10k+ parts

$11.813

10,364

-

$14.025

$12.550

$11.813

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,445 parts In-Stock

1+ parts

$11.875

100+ parts

-

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2,445

$11.875

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Chip Stock

USA . 32,000 parts In-Stock

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32,000

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Vyrian

USA . 13,309 parts In-Stock

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13,309

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 293 parts In-Stock

1+ parts

$11.240

100+ parts

-

1k+ parts

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10k+ parts

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293

$11.240

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-

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Corphita

USA . 97 parts In-Stock

1+ parts

$11.250

100+ parts

-

1k+ parts

-

10k+ parts

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97

$11.250

-

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AZTECH Wire

Italy . 1,180 parts In-Stock

1+ parts

$14.650

100+ parts

-

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1,180

$14.650

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Continental Prestige Electronics

USA . 20,502 parts In-Stock

1+ parts

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20,502

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TANS Electronics

Latvia . 8,294 parts In-Stock

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8,294

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Problanco Electronics

Mexico . 7,937 parts In-Stock

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7,937

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SupplyDigital Components

Austria . 2,791 parts In-Stock

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2,791

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Perfect Parts

USA . 2,540 parts In-Stock

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2,540

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Kulean Microsystems

USA . 829 parts In-Stock

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829

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UHIMA Technologies

Türkiye . 675 parts In-Stock

1+ parts

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675

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GreenTree Electronics

Israel . 324 parts In-Stock

1+ parts

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324

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Authorized Procurement Solutions

USA . 324 parts In-Stock

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324

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Microchip USA

USA . 115 parts In-Stock

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115

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Overview

Enhance your electronic designs with the MC100EP116MNG by Onsemi. This high-quality line driver & receiver offers unmatched performance and reliability, thanks to Onsemi's cutting-edge technology and expertise. Ideal for a wide range of applications, this product provides seamless communication and exceptional signal integrity. Experience the value of faster data transmission, precise timing, and superior functionality with the MC100EP116MNG. Elevate your projects with this innovative solution from a trusted manufacturer.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and reducing the overall footprint of the product.

Maximum Supply Voltage: 5.5 V

Can handle high supply voltages, making it versatile and compatible with a wide range of systems.

No. of Functions: 6

Provides multiple functions in a single device, simplifying the design and reducing component count.

Package Shape: SQUARE

Square package shape is compact and efficient for space-constrained applications.

Maximum Transmit Delay: 0.34 ns

Delivers high-speed data transmission with minimal delay, ensuring quick and efficient communication.

Power Supplies (V): -4.5

Supports a negative supply voltage, enabling compatibility with systems that require negative voltage operation.

No. of Terminals: 21

Provides ample terminals for connectivity options, facilitating versatile integration into various setups.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

Chip carrier package style with a very thin profile offers space-saving benefits and allows for dense integration on circuit boards.

Minimum Supply Voltage: 3 V

Can operate at low supply voltages, offering flexibility in power requirements and energy efficiency.

Maximum Operating Temperature: 85 °C

Operates reliably at high temperatures, suitable for industrial environments and applications with demanding thermal conditions.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, ensuring reliable performance in a wide range of temperature environments.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance for a long-lasting and reliable connection.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections, reducing the risk of signal interference or loss.

Maximum Seated Height: 1 mm

Low-profile design with a maximum seated height of 1 mm is ideal for compact and slim device designs.

Width: 5 mm

Narrow width of 5 mm allows for tight integration and efficient use of board space.

Receiver No. of Bits: 6

6-bit receiver provides accurate signal reception and data processing for enhanced communication reliability.

Differential Output: YES

Differential output improves noise immunity and signal integrity, ensuring robust performance in noisy environments.

Maximum Time At Peak Reflow Temperature (s): 30

Withstands peak reflow temperatures for up to 30 seconds, enabling reliable soldering during assembly processes.

Peak Reflow Temperature °C: 260

Capable of withstanding high peak reflow temperatures of 260 °C, meeting industry standards for soldering.

Length: 5 mm

Compact length of 5 mm complements the square package shape for overall space efficiency.

Temperature Grade: INDUSTRIAL

Meets industrial-grade standards for reliable performance in harsh environmental conditions and extended operating temperatures.

Maximum Receive Delay: 0.34 ns

Delivers fast reception with minimal delay, ensuring swift data processing and response times.

Technology: ECL

Utilizes ECL technology for high-speed operation and low noise, ideal for applications requiring fast and accurate data transmission.

Terminal Form: NO LEAD

No-lead terminal form simplifies the assembly process and enhances durability during handling and operation.

Maximum Supply Current: 95 mA

Handles high supply currents of up to 95 mA, ensuring stable operation and reliable performance under varying load conditions.

Input Characteristics: DIFFERENTIAL

Differential input enhances signal quality and noise rejection, improving overall system performance in challenging environments.

Nominal Supply Voltage: 3.3 V

Operates at a nominal supply voltage of 3.3 V, providing a standardized power input for efficient and consistent performance.

Nominal Negative Supply Voltage: -4.5 V

Supports a nominal negative supply voltage of -4.5 V, catering to systems that require dual power supplies for proper functionality.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm enables precise and compact connections, optimizing signal integrity and reducing signal cross-talk.

Driver No. of Bits: 6

6-bit driver enables accurate and controlled signal transmission, ensuring clear and reliable communication between devices.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type supports bidirectional data transmission, making it suitable for applications requiring versatile connectivity options.

Technical Specifications

Line Drivers & Receivers MC100EP116MNG attributes and parameters. Explore more Line Drivers & Receivers devices from Onsemi

Specs

Additional Features:

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Differential Output:

YES

Driver No. of Bits:

6

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-XQCC-N21

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-4.5 V

No. of Functions:

6

No. of Terminals:

21

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Receive Delay:

.34 ns

Receiver No. of Bits:

6

Maximum Seated Height:

1 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

95 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

.34 ns

Width:

5 mm

Trade Compliance

MC100EP116MNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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