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MC100E431FNR2G

Onsemi

MC100E431FNR2G by Onsemi

MC100E431FNR2G by Onsemi is a 28-terminal ECL flip-flop with 3 functions, operating at a max frequency of 1.1 GHz. It has a propagation delay of 0.85 ns and operates b/w -4.5V to 5.7V, making it ideal for high-speed applications requiring fast trigger response and complementary output polarity.

Median Price

$6.255

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$5.560

1k+ parts

$4.970

10k+ parts

$4.680

90

-

$5.560

$4.970

$4.680

Verical

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$6.950

1k+ parts

$6.213

10k+ parts

$5.850

90

-

$6.950

$6.213

$5.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,244 parts In-Stock

1+ parts

$5.871

100+ parts

-

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1,244

$5.871

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Vyrian

USA . 5,632 parts In-Stock

1+ parts

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5,632

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-

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Mil-Aero Solutions, Inc.

USA . 175 parts In-Stock

1+ parts

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175

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 608 parts In-Stock

1+ parts

$5.562

100+ parts

-

1k+ parts

-

10k+ parts

-

608

$5.562

-

-

-

Corohmni

South Africa . 500 parts In-Stock

1+ parts

$6.180

100+ parts

-

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-

500

$6.180

-

-

-

AZTECH Wire

Italy . 599 parts In-Stock

1+ parts

$19.220

100+ parts

-

1k+ parts

-

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599

$19.220

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 25,042 parts In-Stock

1+ parts

-

100+ parts

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25,042

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Kulean Microsystems

USA . 7,545 parts In-Stock

1+ parts

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7,545

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SupplyDigital Components

Austria . 6,069 parts In-Stock

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6,069

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Microchip USA

USA . 5,801 parts In-Stock

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5,801

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TANS Electronics

Latvia . 5,674 parts In-Stock

1+ parts

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5,674

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-

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Problanco Electronics

Mexico . 5,369 parts In-Stock

1+ parts

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5,369

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UHIMA Technologies

Türkiye . 153 parts In-Stock

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153

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Overview

Experience the unmatched quality and reliability of Onsemi with the MC100E431FNR2G. This versatile latch and flip-flop device offers customers a high-performance solution for a wide range of applications. With its advanced technology and innovative design, this product ensures seamless operation and consistent output. Trust Onsemi to deliver value and efficiency with the MC100E431FNR2G, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the latch durable and resistant to damage, ensuring a long lifespan for the product.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into existing circuit boards or systems.

No. of Functions: 3

Having multiple functions in one component saves space and simplifies circuit design, making it more efficient.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common standard in many electronic systems, allowing for seamless compatibility.

Output Characteristics: OPEN-EMITTER

The open-emitter output characteristics provide flexibility for connecting to other components or devices in the circuit.

Maximum Frequency At Nominal Supply: 1000000000 Hz

With a high maximum frequency, this latch is capable of handling rapid data processing and high-speed applications.

Technical Specifications

Latches & Flip-Flops MC100E431FNR2G attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

1000000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

152 mA

Propagation Delay (tpd):

.85 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

11.505 mm

Minimum fmax:

1100 MHz

Trade Compliance

MC100E431FNR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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