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MC100E131FNG

Onsemi

MC100E131FNG by Onsemi

MC100E131FNG by Onsemi is a 4-bit latch with 0.675 ns propagation delay, operating at up to 1.1 GHz frequency. It has a supply voltage range of 4.2V to 5.7V and is ideal for high-speed applications requiring positive edge triggering in ECL technology.

Median Price

$13.590

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 25 parts In-Stock

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$13.590

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Digiode

USA . 1,283 parts In-Stock

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$12.910

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Vyrian

USA . 1,935 parts In-Stock

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Semi Source

USA . 68 parts In-Stock

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ComSIT Distribution GmbH

Germany . 35 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

USA . 12 parts In-Stock

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Sunrise Surplus Inc.

USA . 3 parts In-Stock

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ECAB

Sweden . 2 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,540 parts In-Stock

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$12.231

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Corohmni

South Africa . 481 parts In-Stock

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$13.590

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Component Stockers USA

USA . 38 parts In-Stock

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$18.810

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Microchip USA

USA . 2,290 parts In-Stock

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$34.384

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Problanco Electronics

Mexico . 7,187 parts In-Stock

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Kulean Microsystems

USA . 4,467 parts In-Stock

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TANS Electronics

Latvia . 1,039 parts In-Stock

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UHIMA Technologies

Türkiye . 444 parts In-Stock

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SupplyDigital Components

Austria . 194 parts In-Stock

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Perfect Parts

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Kepictronics

USA . 57 parts In-Stock

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Overview

Unleash the power of innovation with the MC100E131FNG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality latches & flip-flops designed for high-performance applications. With a focus on reliability and efficiency, this product offers customers unparalleled value and benefits. Whether you're looking to enhance your electronic systems or streamline your operations, the MC100E131FNG is the perfect solution for all your needs. Trust Onsemi to provide cutting-edge technology that exceeds expectations and drives success. Elevate your projects with the MC100E131FNG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during production.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures compatibility with standard electronic systems, making it easy to integrate into existing designs.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in demanding environments.

Maximum Frequency At Nominal Supply: 1000000000 Hz

With a high maximum frequency, this product is capable of handling fast data processing and high-speed operations efficiently.

Technical Specifications

Latches & Flip-Flops MC100E131FNG attributes and parameters. Explore more Latches & Flip-Flops devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V

Family:

100E

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.505 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

1000000000 Hz

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Maximum Power Supply Current (ICC):

81 mA

Propagation Delay (tpd):

.675 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.7 V

Minimum Supply Voltage (Vsup):

4.2 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

11.505 mm

Minimum fmax:

1100 MHz

Trade Compliance

MC100E131FNG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-581-6182, 5962015816182

NIIN

015816182

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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