Loading...

LV8105W

Onsemi

LV8105W by Onsemi

LV8105W by Onsemi is a Motion Control IC with 24V nominal voltage. It features 48 terminals, BICMOS technology, and operates b/w -20 to 80 °C. Ideal for applications requiring precise motion control in commercial extended temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,725

-

-

-

-

Digiode

USA . 714 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

714

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Kulean Microsystems

USA . 5,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,680

-

-

-

-

SupplyDigital Components

Austria . 3,078 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,078

-

-

-

-

Problanco Electronics

Mexico . 1,605 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,605

-

-

-

-

TANS Electronics

Latvia . 1,425 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,425

-

-

-

-

UHIMA Technologies

Türkiye . 908 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

908

-

-

-

-

Corphita

USA . 824 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

824

-

-

-

-

Corohmni

South Africa . 305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

305

-

-

-

-

Overview

Elevate your motion control systems with the LV8105W by Onsemi, a top-of-the-line solution for precise and efficient movements. Manufactured by industry leader Onsemi, this cutting-edge Motion Control IC boasts high-quality construction and reliability, ensuring optimal performance in a variety of applications. With a nominal supply voltage of 24V and a maximum operating temperature of 80 °C, this IC is designed to deliver consistent power and functionality. Say goodbye to limitations and hello to seamless motion control with the LV8105W by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller form factor and easier integration into electronic systems.

Nominal Supply Voltage (Vsup): 24 V

A 24V supply voltage is common in industrial applications, providing compatibility with many systems.

Maximum Operating Temperature: 80 °C

The high maximum operating temperature ensures reliability in demanding environments.

No. of Terminals: 48

Having a high number of terminals allows for more connections and flexibility in design.

Technology: BICMOS

BICMOS technology offers a combination of high speed and low power consumption, enhancing performance.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for high density integration and more connections in a limited space.

Technical Specifications

Motion Control ICs LV8105W attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G48

No. of Terminals:

48

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

24

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

8.8 mA

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

LV8105W Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20