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LV8127T

Onsemi

LV8127T by Onsemi

LV8127T by Onsemi is a Motion Control IC with 36 terminals, operating b/w -30 to 100 °C. It's a Brushless DC Motor Controller with max output current of 0.05 A and Vsup ranging from 12-18 V. Ideal for applications requiring precise motion control in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,349 parts In-Stock

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Digiode

USA . 207 parts In-Stock

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SupplyDigital Components

Austria . 8,128 parts In-Stock

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Problanco Electronics

Mexico . 5,678 parts In-Stock

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TANS Electronics

Latvia . 4,440 parts In-Stock

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Kulean Microsystems

USA . 4,220 parts In-Stock

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Corphita

USA . 1,088 parts In-Stock

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UHIMA Technologies

Türkiye . 653 parts In-Stock

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Corohmni

South Africa . 417 parts In-Stock

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Overview

Enhance your motion control applications with the LV8127T by Onsemi. Crafted with precision and quality in mind, this Brushless DC Motor Controller offers unparalleled performance and reliability. With its compact design and advanced features, this IC is ideal for a wide range of industries, from automotive to industrial automation. Experience seamless operation and optimal efficiency with the LV8127T, providing value and benefits that will elevate your projects to new heights. Choose Onsemi for cutting-edge technology and superior products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the components inside the package, ensuring reliability and long-term functionality.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto PCBs, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 16 V

Suitable nominal supply voltage of 16V provides adequate power for the motion control IC to operate efficiently without risk of overloading.

No. of Terminals: 36

Having 36 terminals allows for a high level of connectivity and versatility in connecting the IC to various components in a motion control system.

Maximum Operating Temperature: 100 °C

High maximum operating temperature of 100 °C ensures the IC can withstand harsh operating environments without compromising performance.

Width (mm): 5.6 mm

Compact width of 5.6mm enables space-efficient design and integration into tight spaces or small electronic devices.

Other IC type: BRUSHLESS DC MOTOR CONTROLLER

Being a brushless DC motor controller, this IC offers efficiency, precision, and reliability in controlling brushless motors, making it ideal for various motion control applications.

Maximum Supply Voltage (Vsup): 18 V

With a maximum supply voltage of 18V, the IC can handle higher input voltages when needed without risking damage or malfunction.

Technical Specifications

Motion Control ICs LV8127T attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPERATES IN 18 TO 185V SUPPLY

JESD-30 Code:

R-PDSO-G36

Length:

9.75 mm

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.05 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

12 V

Nominal Supply Voltage (Vsup):

16 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

5.6 mm

Trade Compliance

LV8127T Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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