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LV8121V-TLM-H

Onsemi

LV8121V-TLM-H by Onsemi

LV8121V-TLM-H by Onsemi is a Motion Control IC with 24V supply, 3.5A output current, and BICMOS technology. Ideal for Brushless DC Motor Controllers, it operates b/w -30 to 100 °C and has a compact rectangular package with 44 terminals for surface mounting applications.

Median Price

$3.419

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,690 parts In-Stock

1+ parts

-

100+ parts

$2.950

1k+ parts

$2.640

10k+ parts

$2.490

1,690

-

$2.950

$2.640

$2.490

Verical

USA . 1,690 parts In-Stock

1+ parts

-

100+ parts

$3.888

1k+ parts

$3.300

10k+ parts

$3.112

1,690

-

$3.888

$3.300

$3.112

Element14

Singapore . 306 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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306

-

-

-

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Distributors (In-Stock)

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Digiode

USA . 519 parts In-Stock

1+ parts

$3.278

100+ parts

-

1k+ parts

-

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519

$3.278

-

-

-

Chip Stock

USA . 66,000 parts In-Stock

1+ parts

-

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66,000

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Vyrian

USA . 7,771 parts In-Stock

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7,771

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Flip Electronics

USA . 2,000 parts In-Stock

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2,000

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 807 parts In-Stock

1+ parts

$2.930

100+ parts

-

1k+ parts

-

10k+ parts

-

807

$2.930

-

-

-

Corphita

USA . 431 parts In-Stock

1+ parts

$3.105

100+ parts

-

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-

431

$3.105

-

-

-

Corohmni

South Africa . 468 parts In-Stock

1+ parts

$3.450

100+ parts

-

1k+ parts

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468

$3.450

-

-

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AZTECH Wire

Italy . 344 parts In-Stock

1+ parts

$11.640

100+ parts

-

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344

$11.640

-

-

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Component Stockers USA

USA . 645 parts In-Stock

1+ parts

$99.990

100+ parts

-

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645

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 29,704 parts In-Stock

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29,704

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Perfect Parts

USA . 10,371 parts In-Stock

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10,371

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Kulean Microsystems

USA . 7,290 parts In-Stock

1+ parts

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7,290

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TANS Electronics

Latvia . 6,429 parts In-Stock

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6,429

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Authorized Procurement Solutions

USA . 2,200 parts In-Stock

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2,200

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Problanco Electronics

Mexico . 1,416 parts In-Stock

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1,416

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Kepictronics

USA . 959 parts In-Stock

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959

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UHIMA Technologies

Türkiye . 920 parts In-Stock

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920

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-

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SupplyDigital Components

Austria . 640 parts In-Stock

1+ parts

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1k+ parts

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640

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Microchip USA

USA . 394 parts In-Stock

1+ parts

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394

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Overview

Experience the seamless precision and efficiency of motion control with the LV8121V-TLM-H by Onsemi. Crafted by a reputable manufacturer, this innovative Motion Control IC offers unparalleled quality and reliability. Ideal for applications in various industries, this product delivers exceptional value and benefits to customers seeking top-notch performance. Elevate your projects with the cutting-edge technology and superior functionality of the LV8121V-TLM-H.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and costs in production.

Nominal Supply Voltage (Vsup): 24 V

Ideal voltage for powering the motion control IC, ensuring optimal performance.

Maximum Operating Temperature: 100 °C

Allows the motion control IC to operate in a wide range of temperature environments, making it versatile and reliable.

Minimum Operating Temperature: -30 °C

Ensures the motion control IC can function effectively even in cold temperature conditions, expanding its usability.

Technology: BICMOS

Combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Motion Control ICs LV8121V-TLM-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e6

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

3.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP44,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

4.7 mA

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.6 mm

Trade Compliance

LV8121V-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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