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LV8104V-MPB-H

Onsemi

LV8104V-MPB-H by Onsemi

LV8104V-MPB-H by Onsemi is a Motion Control IC with 44 terminals, operating at -20 to 80 °C. It supports a supply voltage range of 16-28V and output current up to 0.015A. Ideal for Brushless DC Motor control applications due to its BICMOS technology and compact design.

Median Price

$1.900

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,653 parts In-Stock

1+ parts

-

100+ parts

$1.900

1k+ parts

$1.700

10k+ parts

$1.600

1,653

-

$1.900

$1.700

$1.600

DigiKey

USA . 1,653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.500

10k+ parts

-

1,653

-

-

$2.500

-

Farnell

UK . 1,653 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.860

10k+ parts

-

1,653

-

-

$1.860

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,439 parts In-Stock

1+ parts

$2.004

100+ parts

-

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-

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2,439

$2.004

-

-

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Vyrian

USA . 6,354 parts In-Stock

1+ parts

-

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6,354

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 462 parts In-Stock

1+ parts

$1.860

100+ parts

-

1k+ parts

-

10k+ parts

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462

$1.860

-

-

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Corphita

USA . 801 parts In-Stock

1+ parts

$1.899

100+ parts

-

1k+ parts

-

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801

$1.899

-

-

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AZTECH Wire

Italy . 786 parts In-Stock

1+ parts

$18.650

100+ parts

-

1k+ parts

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10k+ parts

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786

$18.650

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 28,411 parts In-Stock

1+ parts

-

100+ parts

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28,411

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-

-

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SupplyDigital Components

Austria . 7,065 parts In-Stock

1+ parts

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7,065

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TANS Electronics

Latvia . 5,311 parts In-Stock

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5,311

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Continental Prestige Electronics

USA . 1,653 parts In-Stock

1+ parts

-

100+ parts

$1.800

1k+ parts

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10k+ parts

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1,653

-

$1.800

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UHIMA Technologies

Türkiye . 489 parts In-Stock

1+ parts

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489

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Microchip USA

USA . 396 parts In-Stock

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396

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Problanco Electronics

Mexico . 298 parts In-Stock

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298

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Kulean Microsystems

USA . 194 parts In-Stock

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194

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Overview

Enhance the performance of your motion control applications with the LV8104V-MPB-H by Onsemi. Crafted with precision and expertise, Onsemi guarantees top-notch quality in every aspect of this Brushless DC Motor Controller. Ideal for a wide range of industrial and automotive applications, this innovative product offers unparalleled value and benefits to customers. Trust Onsemi to deliver reliability, efficiency, and cutting-edge technology all in one compact and versatile package. Elevate your projects with Onsemi's Motion Control ICs and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the IC, ensuring reliable performance over time.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 24 V

The nominal supply voltage of 24 V is suitable for a wide range of applications, providing a stable power source for the IC to operate effectively.

Maximum Operating Temperature: 80 °C

With a maximum operating temperature of 80 °C, this IC can withstand high temperature environments, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -20 °C

The minimum operating temperature of -20 °C ensures reliable performance even in cold environments, making it versatile for various operating conditions.

Technology: BICMOS

Utilizing BICMOS technology combines the advantages of both Bipolar and CMOS technologies, providing high-speed operation and low power consumption for efficient performance.

Technical Specifications

Motion Control ICs LV8104V-MPB-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e6

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

.015 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP44,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

8.2 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

16 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.6 mm

Trade Compliance

LV8104V-MPB-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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