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LV8112V-TLM-H

Onsemi

LV8112V-TLM-H by Onsemi

LV8112V-TLM-H by Onsemi is a Motion Control IC with 24V supply, 3A output current, and BICMOS technology. Ideal for Brushless DC Motor Controllers, it operates b/w -25 to 80 °C in commercial applications. Package: Small Outline, Low Profile, Shrink Pitch.

Median Price

$1.438

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

$1.280

1k+ parts

$1.150

10k+ parts

$1.080

12,500

-

$1.280

$1.150

$1.080

DigiKey

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.690

10k+ parts

-

12,500

-

-

$1.690

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Verical

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.438

10k+ parts

$1.350

12,500

-

-

$1.438

$1.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,143 parts In-Stock

1+ parts

$1.260

100+ parts

-

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1,143

$1.260

-

-

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Digiode

USA . 1,321 parts In-Stock

1+ parts

$1.358

100+ parts

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1,321

$1.358

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Chip Stock

USA . 44,000 parts In-Stock

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44,000

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Distributors (Availability)

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Corohmni

South Africa . 412 parts In-Stock

1+ parts

$1.260

100+ parts

-

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412

$1.260

-

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Corphita

USA . 627 parts In-Stock

1+ parts

$1.287

100+ parts

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627

$1.287

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Continental Prestige Electronics

USA . 12,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$1.220

10k+ parts

-

12,500

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-

$1.220

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QUARKTWIN TECHNOLOGY LTD

USA . 8,289 parts In-Stock

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8,289

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Problanco Electronics

Mexico . 6,952 parts In-Stock

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6,952

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Microchip USA

USA . 4,749 parts In-Stock

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4,749

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SupplyDigital Components

Austria . 4,272 parts In-Stock

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4,272

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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TANS Electronics

Latvia . 2,979 parts In-Stock

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2,979

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Perfect Parts

USA . 1,400 parts In-Stock

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1,400

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UHIMA Technologies

Türkiye . 767 parts In-Stock

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767

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Kulean Microsystems

USA . 103 parts In-Stock

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103

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Overview

Elevate your motion control applications with the LV8112V-TLM-H by Onsemi. Crafted with precision and expertise, this motion control IC offers unparalleled quality and reliability. Designed for efficiency and performance, this product from Onsemi is the perfect solution for a wide range of applications. With its advanced technology and sleek design, the LV8112V-TLM-H provides customers with unmatched value and benefits. Experience seamless operation and precise control like never before with this innovative product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Enables easy installation on circuit boards, making it suitable for automated assembly processes.

Nominal Supply Voltage (Vsup): 24 V

Compatible with common power supply systems, making it easy to integrate into existing setups.

Maximum Operating Temperature: 80 °C

Allows for reliable operation in various environmental conditions without the risk of overheating.

Technology: BICMOS

Uses a combination of bipolar and CMOS technologies for efficient performance and low power consumption.

Technical Specifications

Motion Control ICs LV8112V-TLM-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e6

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-25 Cel

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP44,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

6.5 mA

Maximum Supply Voltage (Vsup):

35 V

Minimum Supply Voltage (Vsup):

10 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.6 mm

Trade Compliance

LV8112V-TLM-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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