Loading...

LV4991TT-TLM-E

Onsemi

LV4991TT-TLM-E by Onsemi

LV4991TT-TLM-E by Onsemi is an 8-terminal audio amplifier IC with a power supply of 3.6V, operating b/w -40 to 85 °C. It features BICMOS technology, GULL WING terminals, and a small outline package shape. Ideal for audio and video amplification applications requiring industrial temperature grade components.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,444 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,444

-

-

-

-

Digiode

USA . 1,531 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,531

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,026 parts In-Stock

1+ parts

$9.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,026

$9.800

-

-

-

AZTECH Wire

Italy . 1,165 parts In-Stock

1+ parts

$11.470

100+ parts

-

1k+ parts

-

10k+ parts

-

1,165

$11.470

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 25,192 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,192

-

-

-

-

TANS Electronics

Latvia . 7,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,828

-

-

-

-

Kulean Microsystems

USA . 6,243 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,243

-

-

-

-

Microchip USA

USA . 4,719 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,719

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

SupplyDigital Components

Austria . 2,889 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,889

-

-

-

-

Problanco Electronics

Mexico . 2,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,650

-

-

-

-

Metaverse IC Inc.

Canada . 1,970 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,970

-

-

-

-

UHIMA Technologies

Türkiye . 519 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

519

-

-

-

-

Corphita

USA . 269 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

269

-

-

-

-

Corohmni

South Africa . 228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

228

-

-

-

-

Overview

Enhance your audio and video experience with the LV4991TT-TLM-E by Onsemi, a premium quality audio amplifier designed to elevate your sound system to new heights. Manufactured by Onsemi, a trusted name in the industry known for their cutting-edge technology and innovation, this amplifier offers unparalleled performance and reliability. Ideal for a wide range of applications, this product delivers crystal-clear sound and exceptional clarity. Upgrade your audio setup today and enjoy the benefits of superior quality and advanced technology with the LV4991TT-TLM-E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the internal components of the amplifier.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various audio and video equipment.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to fit the amplifier into compact spaces or crowded circuit boards.

Power Supplies (V): 3.6

Operates on a low voltage of 3.6V, making it energy-efficient and suitable for portable devices.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures of up to 85 °C, ideal for use in industrial or outdoor environments.

Technology: BICMOS

Utilizes Bipolar-CMOS technology for improved performance and power efficiency in audio amplification.

Technical Specifications

Audio & Video Amplifiers LV4991TT-TLM-E attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.6

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

6 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LV4991TT-TLM-E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20