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LV4991TH-TLM-E

Onsemi

LV4991TH-TLM-E by Onsemi

LV4991TH-TLM-E by Onsemi is an audio amplifier IC with 8 terminals, operating from -40 to 85 °C. It has a power supply of 3.6V and max current of 6mA. Ideal for industrial applications requiring small outline, thin profile amplifiers in plastic/epoxy packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,862 parts In-Stock

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Digiode

USA . 1,260 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 419 parts In-Stock

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$12.460

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419

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Component Stockers USA

USA . 458 parts In-Stock

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$99.990

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458

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TANS Electronics

Latvia . 6,829 parts In-Stock

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Kulean Microsystems

USA . 5,457 parts In-Stock

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SupplyDigital Components

Austria . 3,501 parts In-Stock

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Problanco Electronics

Mexico . 2,282 parts In-Stock

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UHIMA Technologies

Türkiye . 724 parts In-Stock

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724

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Corphita

USA . 439 parts In-Stock

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Corohmni

South Africa . 246 parts In-Stock

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Microchip USA

USA . 204 parts In-Stock

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Overview

Enhance your audio and video projects with the LV4991TH-TLM-E by Onsemi. This high-quality audio amplifier offers unparalleled performance and reliability, thanks to Onsemi's reputation for excellence in manufacturing. Perfect for a wide range of applications, this product provides exceptional value and benefits to our customers. Upgrade your audio experience today with the LV4991TH-TLM-E and enjoy superior sound quality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material is lightweight and durable, making the amplifier easy to handle and resistant to damage during handling and installation.

Surface Mount: YES

Being surface mount compatible allows for easier and more efficient PCB assembly, saving time and reducing production costs.

Power Supplies (V): 3.6

The 3.6V power supply allows for efficient power consumption, leading to lower energy costs and longer battery life in portable devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this amplifier can withstand high levels of heat, ensuring reliable performance even in demanding environments.

Technology: BICMOS

The BICMOS technology used in this amplifier combines the advantages of both bipolar and CMOS technologies, providing high performance, low power consumption, and improved noise immunity.

Technical Specifications

Audio & Video Amplifiers LV4991TH-TLM-E attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.6

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

6 mA

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

LV4991TH-TLM-E General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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