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LC898111AXA-MH

Onsemi

LC898111AXA-MH by Onsemi

LC898111AXA-MH by Onsemi is a 48-terminal IC with CMOS technology. It operates at supply voltages b/w 2.6V to 3.6V, making it suitable for interface circuit applications. The package style is grid array with very thin profile and fine pitch, ideal for surface mount designs.

Median Price

$2.225

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,950 parts In-Stock

1+ parts

-

100+ parts

$1.990

1k+ parts

$1.780

10k+ parts

$1.670

4,950

-

$1.990

$1.780

$1.670

DigiKey

USA . 4,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.610

10k+ parts

-

4,950

-

-

$2.610

-

Verical

USA . 4,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.225

10k+ parts

-

4,950

-

-

$2.225

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 868 parts In-Stock

1+ parts

$2.100

100+ parts

-

1k+ parts

-

10k+ parts

-

868

$2.100

-

-

-

Vyrian

USA . 2,471 parts In-Stock

1+ parts

$2.210

100+ parts

-

1k+ parts

-

10k+ parts

-

2,471

$2.210

-

-

-

DigiKey Marketplace

USA . 4,950 parts In-Stock

1+ parts

-

100+ parts

$2.300

1k+ parts

-

10k+ parts

-

4,950

-

$2.300

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 474 parts In-Stock

1+ parts

$1.820

100+ parts

-

1k+ parts

-

10k+ parts

-

474

$1.820

-

-

-

Ampacity Inc.

Singapore . 4,602 parts In-Stock

1+ parts

$1.880

100+ parts

-

1k+ parts

-

10k+ parts

-

4,602

$1.880

-

-

-

Corphita

USA . 2,193 parts In-Stock

1+ parts

$1.989

100+ parts

-

1k+ parts

-

10k+ parts

-

2,193

$1.989

-

-

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SupplyDigital Components

Austria . 6,992 parts In-Stock

1+ parts

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100+ parts

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6,992

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Continental Prestige Electronics

USA . 4,950 parts In-Stock

1+ parts

-

100+ parts

$1.820

1k+ parts

-

10k+ parts

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4,950

-

$1.820

-

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Problanco Electronics

Mexico . 2,848 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,848

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-

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UHIMA Technologies

Türkiye . 880 parts In-Stock

1+ parts

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880

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Kulean Microsystems

USA . 746 parts In-Stock

1+ parts

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1k+ parts

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746

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TANS Electronics

Latvia . 640 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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640

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Overview

Enhance your electronic devices with the LC898111AXA-MH by Onsemi, a cutting-edge Other Function Interface IC that offers unparalleled quality and reliability. Onsemi is a trusted manufacturer known for producing high-performance components, and this product is no exception. With its versatile applications and advanced technology, this interface circuit provides customers with superior value and benefits. Upgrade your electronics today with the LC898111AXA-MH and experience the advantages of seamless integration and enhanced functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits, ensuring longevity and reliability of the product.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

Supports a wide range of applications and provides flexibility in voltage requirements.

Package Shape: RECTANGULAR

Rectangular shape makes it easier to integrate into various design layouts and configurations.

No. of Terminals: 48

Offers ample connectivity options for interfacing with other components and systems.

Minimum Supply Voltage: 2.6 V

Allows for operation in low-power settings, increasing energy efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the interface circuit.

Nominal Supply Voltage: 3 V

Stable and consistent power supply for optimal functioning of the interface circuit.

Technical Specifications

Other Function Interface ICs LC898111AXA-MH attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PBGA-B48

Length:

3.22 mm

No. of Functions:

1

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.33 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.6 V

Nominal Supply Voltage:

3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

2.6 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

2.57 mm

Trade Compliance

LC898111AXA-MH Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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